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Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration
The scaling of GPUs for AI and HPC workloads is increasingly constrained by the capacity, bandwidth, and thermal limits of both 2.5D HBM-GPU and direct-stacked 3D HBM-on-GPU integration. This work establishes the thermal design envelope for 3D volumetric DRAM-on-GPU integration, in which vertically
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