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Thermal Atomic Layer Deposition of Transition Metal Phosphide Thin Films

Hues, John Douglas
Boise State ScholarWorks · Papers
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aldmaterials-science-and-engineering
The continued dimensional scaling of features within semiconductor devices has placed immense pressure on the materials that are traditionally used to fabricate devices. Interconnects, which are the conductors that connect individual microelectronic device components together to enable signal transm
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