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3D Structuration Techniques of LTCC for Microsystems Applications

Name: 3D Structuration Techniques of LTCC for Microsystems Applications
Published: 2010
License: Open Access

Fournier, Yannick · 2010

DataCite · Datasets · License: Open Access · 2010

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ltcc low temperature, co-fired ceramic, new 3d structuration techniques, sacrificial volume materials, lamination, smd microfluidic devices, integrated smd multifunction sensor for pressure, flow and temperature

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Record · ID 1100176
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