HAL (France)open access
Collage direct conducteur et hermétique de silicium polycristallin pour l’encapsulation de MEMS
Taux de fuite, Résistivité de contact, CMP, Collage direct hydrophobe et hydrophile et hydrophile, 0, Polysilicium dopé, Encapsulation au niveau de la tranche WLP, MEMS
This document is indexed with metadata only — full text is not available in the archive for this record.
Open the official source ↗
Record · ID 1146688
Retrieved via
Conceptio — every document is proof-bundled with source, license, and retrieval metadata.