Belgium – Laboratory, optical and precision equipments (excl. glasses) – EUV TRACK (HNA/LNA) — Imec EU Pilot line NV (BEL)

2026-10-01+02:00 00:00:00+02:00 0 0 RES-0001 0 0 selec-w TEN-0001 0 0 tenders 1 CON-0001 LOT-0001 RES-0002 0 0 selec-w TEN-0002 0 0 tenders 1 CON-0002 LOT-0002 TEN-0001 0 no TPA-0001 LOT-0001 Tokyo Electron Europe Limited-LOT-0001 TEN-0002 0 no TPA-0001 LOT-0002 Tokyo Electron Europe Limited-LOT-0002 CON-0001 TELCON1 TEN-0001 CON-0002 TELCON2 TEN-0002 TPA-0001 ORG-0004 29 ORG-0001 Imec EU Pilot line NV Imec EU Pilot line NV Kapeldreef 75 Heverlee 3001 BE242 BEL 1004987603_21101 +32 16287789 tom.wauters@imec.be https://bosa.belgium.be ORG-0002 FPS Policy and Support FOD Beleid en Ondersteuning Simon Bolivarlaan 30, bus 1 Brussel 1000 BE100 BEL BE001 +32 2 740 80 00 revise@publicprocurement.be ORG-0003 Ondernemingsrechtbank Leuven Commercial Court Leuven Leuven 3000 BE242 BEL 0308357753 large ORG-0004 Tokyo Electron Europe Limited Tokyo Electron Europe Limited Pioneer Building Crawley Business Center Fleming Way Crawley RH10 9QL GBR 644392429_da96ef64-98aa-4880-9673-01e0dc4b4bb6 kaushik.kumar@europe.tel.com 00680011-2026 191/2026 2026-10-02+02:00 2.3 eforms-sdk-1.13 9aed5a43-c528-42d1-b3cb-cdcf32396e01 cfa9d18e-3657-4314-b375-7f77fb53f5b1 2026-10-01+02:00 00:00:00+02:00 01 2026-10-02+02:00 32014L0024 can-standard NLD ENG https://www.publicprocurement.be/bda?organisationIds=21101&includeOrganisationChildren=true cga gen-pub ORG-0001 ted-esen ORG-0002 neg-wo-call other-exclusive Zie opdrachtdocumenten See tender documents JPA2025ID03/55 EUV TRACK (HNA/LNA) EUV TRACK (HNA/LNA) The high NA - EUV track will support a High NA EUV scanner it gets linked to. The track will prepare the wafers before the exposure, this is pre-treatment of the wafers before coating, the coating of underlayer and photo resist followed by a post application bake. After exposure the track will execute the post exposure bake and development of the photo sensitive material to get the pattern fixed. The track modules need to be precisely controlled to achieve superior results in uniformity within the wafer and from wafer to wafer. It also needs to enable the processing of a wide variety of materials to support the further scaling and continuous evolving semiconductor devices. The low NA - EUV track will support a Low NA EUV scanner it gets linked to. The track will prepare the wafers before the exposure, this is pre-treatment of the wafers before coating, the coating of underlayer and photo resist followed by a post application bake. After exposure the track will execute the post exposure bake and development of the photo sensitive material to get the pattern fixed. The track modules need to be precisely controlled to achieve superior results in uniformity within the wafer and from wafer to wafer. It also needs to enable the processing of a wide variety of materials to support the further scaling and continuous evolving semiconductor devices. The high NA - EUV track will support a High NA EUV scanner it gets linked to. The track will prepare the wafers before the exposure, this is pre-treatment of the wafers before coating, the coating of underlayer and photo resist followed by a post application bake. After exposure the track will execute the post exposure bake and development of the photo sensitive material to get the pattern fixed. The track modules need to be precisely controlled to achieve superior results in uniformity within the wafer and from wafer to wafer. It also needs to enable the processing of a wide variety of materials to support the further scaling and continuous evolving semiconductor devices. The low NA - EUV track will support a Low NA EUV scanner it gets linked to. The track will prepare the wafers before the exposure, this is pre-treatment of the wafers before coating, the coating of underlayer and photo resist followed by a post application bake. After exposure the track will execute the post exposure bake and development of the photo sensitive material to get the pattern fixed. The track modules need to be precisely controlled to achieve superior results in uniformity within the wafer and from wafer to wafer. It also needs to enable the processing of a wide variety of materials to support the further scaling and continuous evolving semiconductor devices. supplies 38000000 BE242 BEL LOT-0001 false false eu-funds Zie opdrachtdocumenten See tender documents price Zie opdrachtdocumenten See tender documents Zie opdrachtdocumenten See tender documents ORG-0003 true false buyer-categories fa-wo-rc none 1 JPA2025ID03/55 - 1 JPA2025ID03/55 - 1 HNA EUV TRACK (ID55) HNA EUV TRACK (ID55) supplies 38000000 BE242 BEL UNLIMITED LOT-0002 false false eu-funds Zie opdrachtdocumenten See tender documents price Zie opdrachtdocumenten See tender documents Zie opdrachtdocumenten See tender documents ORG-0003 true false buyer-categories fa-wo-rc none 2 JPA2025ID03/55 - 2 JPA2025ID03/55 - 2 LNA EUV TRACK (ID03) LNA EUV TRACK (ID03) supplies 38000000 BE242 BEL UNLIMITED 2000-01-01+01:00

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