HAL (France)
open access
Hybrid Laser–Etching Fabrication of High-Density Antireflective Microstructures on DLC-Coated Silicon Using Burst-Mode Bessel Beam Processing
We demonstrate a novel method for fabricating densely packed, high-aspect-ratio cavities (depth to diameter ratio > 1) in silicon wafers coated with diamond-like carbon (DLC). The process combines femtosecond laser irradiation with subsequent wet etch (potassium hydroxide-based) or plasma etch (c
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