DataCite
metadata only
Indentation fracture of gallium arsenide
The scribe and break technique (or dicing) is a widely employed method in the industry of semiconductors to separate infrared laser diodes made from gallium arsenide (GaAs). The scribing step allows to create a precursor crack which is then propagated during the breaking step, along preferential {11
Conceptio Open Archive
Analyze & explore related research in Conceptio
Connect this record directly into your research workflow or AI agent. Explore citations across open repositories, query full text, and export structured proof bundles.
This document is indexed with metadata only: full text is not available in the archive for this record. Open the official source ↗
Related documents
- The Discipline of Dis-Integration: Philosophy Without Redemption#104844
- Quantitative Measurement of ARI#981069
- Teknik IMPLEMENTASI SINAR LASER PADA SIMULASI PENEMBAKAN DENGAN MENAMPILKAN DATA TEMBAK DAN DATA TREMOR PENEMBAK SENAPAN DISATUAN TNI AD: jurnal elkasista#1003119
- Ehegattensplitting-Reform bitte nicht ohne Minijob-Reform#283855
- General paper_2#1348120
Record · ID 1375213
Retrieved via Conceptio: every document is proof-bundled with source, license, and retrieval metadata.
Retrieved via Conceptio: every document is proof-bundled with source, license, and retrieval metadata.
Bring this data into your agent: Connect via MCP or API · 20 free credits to start · no card required
Read the Docs → · View CLI source on GitHub · Conceptio Open Knowledge Archive
Read the Docs → · View CLI source on GitHub · Conceptio Open Knowledge Archive