Finland – Laboratory, optical and precision equipments (excl. glasses) – Notice of discontinuation: Edge-Handling Sputtering Cluster Tool — VTT Technical Research Centre of Finland Ltd (FIN)

2026-10-13+00:00 09:10:08+00:00 RES-0001 clos-nw ins-fund tenders 2 LOT-0000 29 http://www.oikeus.fi/markkinaoikeus ORG-0001 Markkinaoikeus Radanrakentajantie 5 Helsinki 00520 FI1B1 FIN 3006157-6 +358 295643300 markkinaoikeus@oikeus.fi false false https://www.vttresearch.com/fi ORG-0002 VTT Technical Research Centre of Finland Ltd P.O. Box 1000, VTT Espoo 02044 FI1B1 FIN 2647375-4 VTT Technical Research Centre of Finland Ltd +358 20722111 kilpailutus@vtt.fi http://hankintailmoitukset.fi ORG-0003 Hansel Oy (Hilma) Mannerheiminaukio 1a Helsinki 00100 FI1B1 FIN FI09880841 eSender 029 55 636 30 tekninen@hankintailmoitukset.fi 00707454-2026 199/2026 2026-10-14+02:00 2.3 eforms-sdk-1.13 4606c2be-3f61-4c47-ba2d-480b056df739 357c4983-4f91-48ca-80ca-837337c4aaba 2026-10-13+03:00 12:10:07+03:00 01 32014L0024 can-standard ENG pub-undert econ-aff ORG-0002 ted-esen ORG-0003 The tender process is based on the open procedure applicable to contracts that exceed the EU procurement threshold. open 9426cf8e-78ea-485a-acdb-8320f8cb7c7e-01 true The contracting authority (VTT) here states that, due to urgency, it is practically impossible to comply with the standard deadlines for the open procedure set in section 56 § of the Finnish Public Procurement Act. The time limit for submitting the tenders is shortened so that tendering period will be at least 15 days (section 57 §).

The justified reasons for urgency and therefore shortening the deadlines are as follows:

The procurement will be financed as part of a larger EU-wide research project, which VTT will be joining. The project schedule and funding conditions determine the timeline within which the procurements must be carried out. The project schedule and funding conditions are not determined solely by VTT. VTT’s funding depends on the successful completion of the procurements within the overall project schedule and on the equipment being deployed within the given timeframe. For this reason, the contracting entity has decided to shorten the deadlines for procurement procedure set in 56 §, to ensure that it can fulfill its obligations within the specified schedule.

VTT has published a prior information notice of the procurement. Reg. no 19/206/2026 Notice of discontinuation: Edge-Handling Sputtering Cluster Tool The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”).

The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources. During transport and processing, the wafers are mechanically touched only at the wafer edge, and they can be flipped in vacuum between the processes.

The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents. supplies The object of the tender process is described in more detail in the invitation to tender documents. 38000000 Please see the invitation to tender. FI1B1 FIN LOT-0000 false eu-funds per-exa 80 price The evaluation of the tenders is described in section 'Grounds for decision'. per-exa 20 quality Quality The evaluation of the tenders is described in section 'Grounds for decision'. ORG-0002 The appeal period is determined in accordance with the Act on Public Procurement and Concession Contracts (1397/2016). ORG-0001 ORG-0001 false 175060-2026 false none none Reg. no 19/206/2026 Notice of discontinuation: Edge-Handling Sputtering Cluster Tool The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”).

The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources. During transport and processing, the wafers are mechanically touched only at the wafer edge, and they can be flipped in vacuum between the processes.

The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents. supplies The object of the tender process is described in more detail in the invitation to tender documents. 38000000 Please see the invitation to tender. FI1B1 FIN 2026-11-01+02:00 14 2000-01-01Z

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