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Ultralow Dielectric Loss in a High-Frequency and Strong-Adhesion Hydrocarbon Resin Film by Introducing Interfacial Oxygen-Containing Groups and a Microporous Aerogel
Next-generation high-frequency and high-speed telecommunications require printed circuit boards with low dielectric loss and reliable interfacial adhesion to ensure efficient signal transmission and structural integrity. However, the interfacial delamination between copper foils and dielectric subst
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