HAL (France)
open access
Effect of Bonding Pressure and Joint Thickness on the Microstructure and Mechanical Reliability of Sintered Nano-Silver Joints
Sintered nano-silver is widely investigated as a die-attach material for next-generation power electronic modules due to its high thermal conductivity, favorable electrical performance, and stability at elevated temperatures. However, how bonding pressure and joint thickness jointly affect densifica
Conceptio Open Archive
Analyze & explore related research in Conceptio
Connect this record directly into your research workflow or AI agent. Explore citations across open repositories, query full text, and export structured proof bundles.
This document is indexed with metadata only: full text is not available in the archive for this record. Open the official source ↗
Related documents
- Simplified Swarm Optimization for Surrogate-Assisted Reliability Design of Insulated-Gate Bipolar Transistor Power Modules Using an Open-Source Process Finite-Element Model#1216787
- Experimental and Numerical Study of Adding TiO Nanoparticles Effect on the Thermomechanical Behavior of Welded Joints of Steel Buildings#656627
- Structural and mechanistic features of intermetallic materials for lithium batteries#363707
- Thermodynamic stability of twisted domains in AgCrSe$_{2}$ thin films grown on lattice-matched YSZ(111) substrate#1070830
- Microstructure, texture and magnetic coupling parameters of Ir-Mn-based magnetic tunnel junction#639992
Record · ID 1500693
Retrieved via Conceptio: every document is proof-bundled with source, license, and retrieval metadata.
Retrieved via Conceptio: every document is proof-bundled with source, license, and retrieval metadata.
Bring this data into your agent: Connect via MCP or API · 20 free credits to start · no card required
Read the Docs → · View CLI source on GitHub · Conceptio Open Knowledge Archive
Read the Docs → · View CLI source on GitHub · Conceptio Open Knowledge Archive