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Microstructure and mechanical properties of porous copper and copper brazed with cu-based filler metal
engineering-science-and-materialsmanufacturingmaterials-science-and-engineeringmechanical-engineeringmetallurgymicrostructure
In recent time, the heat dissipation rate of electronics increased due to the high volumetric power density they experience. In such circumstances, cooling devices with high heat transfer performance are required. Therefore, adopting porous metal can be critical in applications requiring thermal man
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