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Effect of thermomechanical properties of epoxy molding compound on the reliability of fan-out wafer-level packaging
Epoxy molding compounds (EMCs) play a critical role in determining warpage and interfacial delamination in fan-out wafer-level packaging (FOWLP). In this study, we propose an integrated simulation framework that links the thermomechanical properties of EMCs to package-level warpage and local crac
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