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Architecture-Dependent Disintegration Temperature of Electrospun PNIPAM-Based Scaffolds

Gilyana K Tugaeva et al.
HAL (France) · Papers · License: Open Access
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electrospinning
Electrospinning, Thermoresponsive collapse, NIPAM copolymers, 0, Macromolecular architecture, 1, 2, Scaffold disintegration temperature SDT
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Record · ID 172960
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