Cambridge Apollometadata only
Ultra-High-Voltage 4H-SiC IGBTs Enabled by Wafer Back-Grinding: A Manufacturing Pathway for SiC Bipolar Devices
4014 manufacturing engineering
This document is indexed with metadata only — full text is not available in the archive for this record.
Open the official source ↗
Record · ID 346795
Conceptio Open Knowledge Archive — every document is proof-bundled with source, license, and retrieval metadata.