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Contribution à la conception thermo-mécanique optimmisée d'assemblages sans plomb.

Alexandrine Guedon-Gracia
HAL (France) · Papers · License: Open Access
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thermo
Fiabilité des assemblages électroniques, Alliage de brasage sans plomb, BGA package, Boîtier BGA, Electronics, 0, Thermo-mechanical simulation, Electronique
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Record · ID 374560
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