Google Patentsopen access

Electronic device and communication method using 4G and 5G communication based … — Samsung Electronics Co., Ltd. (US12192843B2)

ABSTRACT

Abstract

Certain embodiments of the present disclosure relate to an electronic device and a communication method thereof. The electronic device includes a housing comprising a first plate and a second plate facing a direction opposite the first plate; a first transceiver disposed in the housing; a second transceiver disposed in the housing and to having a data throughput lower than that of the first transceiver; at least one processor operatively connected to the first transceiver and to the second transceiver; and a memory operative connected to the at least one processor, wherein the memory stores instructions that, when executed, cause the at least one processor to perform operations comprising: determining whether the data throughput of the first transceiver is equal to or greater than a designated reference value, monitoring a temperature of the first transceiver when the data throughput is equal to or greater than the designated reference value, and determining whether to perform a handover from the first transceiver to the second transceiver based at least in part on whether the monitored temperature is equal to or higher than a first designated reference temperature.

Description

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a Continuation of U.S. patent application Ser. No. 17/326,525, filed on May 21, 2021 which is a Continuation of U.S. patent application Ser. No. 16/198,923 filed on Nov. 23, 2018, and assigned U.S. Pat. No. 11,019,548, issued on May 25, 2021 and based on and claims priority under 35 U.S.C. § 119 from Korean Patent Application No. 10-2017-0158289, filed on Nov. 24, 2017, in the Korean Intellectual Property Office, the disclosure of which is incorporated by reference herein in its entirety.

BACKGROUND

1) Field

Certain embodiments of the present disclosure relate to an electronic device and a communication method thereof.

2) Description of Related Art

An electronic device can provide various functions. For example, the electronic device may provide a voice communication function, a short-range wireless communication (e.g., Bluetooth, Wi-Fi, or near field communication (NFC)), a mobile communication (e.g., 3 rd -generation (3G) or 4 th generation (4G)), music or video playback, a camera, and/or positioning and navigation.

In recent years, electronic devices that support a variety of high-speed communication mechanisms (e.g., millimeter wave (mmWave) communication {e.g., Wireless Gigabits (WiGig), 802.11ay, or 5G}) capable of transmitting large amounts of data in a short period of time have been developed.

The increasing functions can cause the electronic device to overheat. Accordingly, it is important to prevent overheating and improve the lifetime of the electronic device.

The above information is presented as background information only to assist with an understanding of the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with regard to the present disclosure.

SUMMARY

When high-speed communication is performed for a long period of time, the electronic device may overheat due to a high data throughput and/or a high current consumption. Due to the overheating of the electronic device, the performance and/or lifetime of components (e.g., a 5G communication processor integrated chip (IC) or a high-speed communication IC such as a WiGig IC) of the electronic device may be shortened. Further, due to the overheating of the electronic device, a user may suffer a low-temperature burn.

An aspect of the present disclosure is to provide an electronic device that may prevent overheating during high-speed communications and a method thereof.

Another aspect of the present disclosure is to provide an electronic device that may perform a handover from high-speed communication to another form of communication when the electronic device overheats due to the high-speed communication, and a method thereof.

In accordance with an aspect of the present disclosure, an electronic device includes a housing comprising a first plate and a second plate facing a direction opposite the first plate; a first transceiver disposed in the housing; a second transceiver disposed in the housing and to having a data throughput lower than that of the first transceiver; at least one processor operatively connected to the first transceiver and to the second transceiver; and a memory operative connected to the at least one processor, wherein the memory stores instructions that, when executed, cause the at least one processor to perform operations comprising: determining whether the data throughput of the first transceiver is equal to or greater than a designated reference value, monitoring a temperature of the first transceiver when the data throughput is equal to or greater than the designated reference value, and determining whether to perform a handover from the first transceiver to the second transceiver based at least in part on whether the monitored temperature is equal to or higher than a first designated reference temperature. In accordance with another aspect of the disclosure, a portable communication device includes one or more temperature sensors; a first transceiver configured to communicate using a first communication protocol; a second transceiver configured to communicate using a second communication protocol; and at least one processor operatively connected to the first transceiver and the second transceiver, wherein the processor performs operations comprising establishing a first communication link between the portable communication device and an external electronic device using the first transceiver, identifying the temperature of the first transceiver using at least one temperature sensor of the one or more temperature sensors while performing wireless communication between the portable communication device and the external electronic device through the first communication connection, and performing a handover, when the temperature of the first transceiver is equal to or higher than a designated temperature, wherein performing the handover comprises establishing a second communication link between the portable communication device and the external electronic device using the second transceiver and terminating the first communication link.

In accordance with still another aspect of the present disclosure, an electronic device includes a first wireless transceiver configured to transmit and/or receive a first signal having a first frequency between 3 GHz and 100 GHz; a second wireless transceiver configured to transmit and/or receive a second signal having a second frequency lower than the first frequency; and a controller, wherein the controller is configured to perform operations comprising: wirelessly communicating first data with an external device using the first wireless transceiver, monitoring usage of the first wireless transceiver while communicating with the external device, and wirelessly communicating second data with the external device using the second wireless transceiver on behalf of the first wireless transceiver, based at least partly on the monitored usage.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certain embodiments of the present disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a block diagram illustrating an electronic device within a network environment according to an embodiment of the present disclosure;

FIG. 2 is a block diagram illustrating an electronic device according to an embodiment of the present disclosure;

FIG. 3 A is a block diagram illustrating a first communication module and a second communication module according to an embodiment of the present disclosure;

FIG. 3 B is a block diagram illustrating a first communication module and a second communication module according to an embodiment of the present disclosure;

FIG. 4 is a flowchart illustrating a communication operation of an electronic device according to an embodiment of the present disclosure;

FIG. 5 A and FIG. 5 B are flowcharts illustrating a communication operation of an electronic device according to an embodiment of the present disclosure;

FIG. 5 C is an exemplary diagram illustrating an example of notifying a user of handover of an electronic device according to an embodiment of the present disclosure;

FIG. 6 is a flowchart illustrating an operation of monitoring the temperature of an electronic device according to an embodiment of the present disclosure;

FIG. 7 is a flowchart illustrating an operation of monitoring the temperature of an electronic device according to an embodiment of the present disclosure; and

FIG. 8 is a flowchart illustrating an operation of monitoring the temperature of an electronic device according to an embodiment of the present disclosure.

DETAILED DESCRIPTION

Hereinafter, certain embodiments of the present disclosure will be described with reference to the accompanying drawings. The present document is intended to illustrate and not to limit the specific embodiments of the certain embodiments of the present disclosure to the particular forms illustrated and described in the accompanying drawings. For example, it is apparent to those skilled in the art that the embodiments of the present disclosure can be modified in various ways.

FIG. 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to certain embodiments. Referring to FIG. 1 , the electronic device 101 in the network environment 100 may communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108 . According to an embodiment, the electronic device 101 may include a processor 120 , memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , a sensor module 176 , an interface 177 , a haptic module 179 , a camera module 180 , a power management module 188 , a battery 189 , a communication module 190 , a subscriber identification module (SIM) 196 , or an antenna module 197 . In some embodiments, at least one (e.g., the display device 160 or the camera module 180 ) of the components may be omitted from the electronic device 101 , or one or more other components may be added in the electronic device 101 . In some embodiments, some of the components may be implemented as single integrated circuitry. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented as embedded in the display device 160 (e.g., a display).

The processor 120 may execute, for example, software (e.g., a program 140 ) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120 , and may perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processor 120 may load a command or data received from another component (e.g., the sensor module 176 or the communication module 190 ) in volatile memory 132 , process the command or the data stored in the volatile memory 132 , and store resulting data in non-volatile memory 134 . According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the <figure-callout id="121" label="main processor" filenames="US12192843-20250107-D0000

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a Continuation of U.S. patent application Ser. No. 17/326,525, filed on May 21, 2021 which is a Continuation of U.S. patent application Ser. No. 16/198,923 filed on Nov. 23, 2018, and assigned U.S. Pat. No. 11,019,548, issued on May 25, 2021 and based on and claims priority under 35 U.S.C. § 119 from Korean Patent Application No. 10-2017-0158289, filed on Nov. 24, 2017, in the Korean Intellectual Property Office, the disclosure of which is incorporated by reference herein in its entirety.

BACKGROUND

1) Field

Certain embodiments of the present disclosure relate to an electronic device and a communication method thereof.

2) Description of Related Art

An electronic device can provide various functions. For example, the electronic device may provide a voice communication function, a short-range wireless communication (e.g., Bluetooth, Wi-Fi, or near field communication (NFC)), a mobile communication (e.g., 3 rd -generation (3G) or 4 th generation (4G)), music or video playback, a camera, and/or positioning and navigation.

In recent years, electronic devices that support a variety of high-speed communication mechanisms (e.g., millimeter wave (mmWave) communication {e.g., Wireless Gigabits (WiGig), 802.11ay, or 5G}) capable of transmitting large amounts of data in a short period of time have been developed.

The increasing functions can cause the electronic device to overheat. Accordingly, it is important to prevent overheating and improve the lifetime of the electronic device.

The above information is presented as background information only to assist with an understanding of the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with regard to the present disclosure.

SUMMARY

When high-speed communication is performed for a long period of time, the electronic device may overheat due to a high data throughput and/or a high current consumption. Due to the overheating of the electronic device, the performance and/or lifetime of components (e.g., a 5G communication processor integrated chip (IC) or a high-speed communication IC such as a WiGig IC) of the electronic device may be shortened. Further, due to the overheating of the electronic device, a user may suffer a low-temperature burn.

An aspect of the present disclosure is to provide an electronic device that may prevent overheating during high-speed communications and a method thereof.

Another aspect of the present disclosure is to provide an electronic device that may perform a handover from high-speed communication to another form of communication when the electronic device overheats due to the high-speed communication, and a method thereof.

In accordance with an aspect of the present disclosure, an electronic device includes a housing comprising a first plate and a second plate facing a direction opposite the first plate; a first transceiver disposed in the housing; a second transceiver disposed in the housing and to having a data throughput lower than that of the first transceiver; at least one processor operatively connected to the first transceiver and to the second transceiver; and a memory operative connected to the at least one processor, wherein the memory stores instructions that, when executed, cause the at least one processor to perform operations comprising: determining whether the data throughput of the first transceiver is equal to or greater than a designated reference value, monitoring a temperature of the first transceiver when the data throughput is equal to or greater than the designated reference value, and determining whether to perform a handover from the first transceiver to the second transceiver based at least in part on whether the monitored temperature is equal to or higher than a first designated reference temperature. In accordance with another aspect of the disclosure, a portable communication device includes one or more temperature sensors; a first transceiver configured to communicate using a first communication protocol; a second transceiver configured to communicate using a second communication protocol; and at least one processor operatively connected to the first transceiver and the second transceiver, wherein the processor performs operations comprising establishing a first communication link between the portable communication device and an external electronic device using the first transceiver, identifying the temperature of the first transceiver using at least one temperature sensor of the one or more temperature sensors while performing wireless communication between the portable communication device and the external electronic device through the first communication connection, and performing a handover, when the temperature of the first transceiver is equal to or higher than a designated temperature, wherein performing the handover comprises establishing a second communication link between the portable communication device and the external electronic device using the second transceiver and terminating the first communication link.

In accordance with still another aspect of the present disclosure, an electronic device includes a first wireless transceiver configured to transmit and/or receive a first signal having a first frequency between 3 GHz and 100 GHz; a second wireless transceiver configured to transmit and/or receive a second signal having a second frequency lower than the first frequency; and a controller, wherein the controller is configured to perform operations comprising: wirelessly communicating first data with an external device using the first wireless transceiver, monitoring usage of the first wireless transceiver while communicating with the external device, and wirelessly communicating second data with the external device using the second wireless transceiver on behalf of the first wireless transceiver, based at least partly on the monitored usage.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certain embodiments of the present disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a block diagram illustrating an electronic device within a network environment according to an embodiment of the present disclosure;

FIG. 2 is a block diagram illustrating an electronic device according to an embodiment of the present disclosure;

FIG. 3 A is a block diagram illustrating a first communication module and a second communication module according to an embodiment of the present disclosure;

FIG. 3 B is a block diagram illustrating a first communication module and a second communication module according to an embodiment of the present disclosure;

FIG. 4 is a flowchart illustrating a communication operation of an electronic device according to an embodiment of the present disclosure;

FIG. 5 A and FIG. 5 B are flowcharts illustrating a communication operation of an electronic device according to an embodiment of the present disclosure;

FIG. 5 C is an exemplary diagram illustrating an example of notifying a user of handover of an electronic device according to an embodiment of the present disclosure;

FIG. 6 is a flowchart illustrating an operation of monitoring the temperature of an electronic device according to an embodiment of the present disclosure;

FIG. 7 is a flowchart illustrating an operation of monitoring the temperature of an electronic device according to an embodiment of the present disclosure; and

FIG. 8 is a flowchart illustrating an operation of monitoring the temperature of an electronic device according to an embodiment of the present disclosure.

DETAILED DESCRIPTION

Hereinafter, certain embodiments of the present disclosure will be described with reference to the accompanying drawings. The present document is intended to illustrate and not to limit the specific embodiments of the certain embodiments of the present disclosure to the particular forms illustrated and described in the accompanying drawings. For example, it is apparent to those skilled in the art that the embodiments of the present disclosure can be modified in various ways.

FIG. 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to certain embodiments. Referring to FIG. 1 , the electronic device 101 in the network environment 100 may communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108 . According to an embodiment, the electronic device 101 may include a processor 120 , memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , a sensor module 176 , an interface 177 , a haptic module 179 , a camera module 180 , a power management module 188 , a battery 189 , a communication module 190 , a subscriber identification module (SIM) 196 , or an antenna module 197 . In some embodiments, at least one (e.g., the display device 160 or the camera module 180 ) of the components may be omitted from the electronic device 101 , or one or more other components may be added in the electronic device 101 . In some embodiments, some of the components may be implemented as single integrated circuitry. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented as embedded in the display device 160 (e.g., a display).

The processor 120 may execute, for example, software (e.g., a program 140 ) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120 , and may perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processor 120 may load a command or data received from another component (e.g., the sensor module 176 or the communication module 190 ) in volatile memory 132 , process the command or the data stored in the volatile memory 132 , and store resulting data in non-volatile memory 134 . According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121 . Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121 , or to be specific to a specified function. The auxiliary processor 123 may be implemented as separate from, or as part of the main processor 121 .

The auxiliary processor 123 may control at least some of functions or states related to at least one component (e.g., the display device 160 , the sensor module 176 , or the communication module 190 ) among the components of the electronic device 101 , instead of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active state (e.g., executing an application). According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190 ) functionally related to the auxiliary processor 123 .

The memory 130 may store various data used by at least one component (e.g., the processor 120 or the sensor module 176 ) of the electronic device 101 . The various data may include, for example, software (e.g., the program 140 ) and input data or output data for a command related thererto. The memory 130 may include the volatile memory 132 or the non-volatile memory 134 .

The program 140 may be stored in the memory 130 as software, and may include, for example, an operating system (OS) 142 , middleware 144 , or an application 146 .

The input device 150 may receive a command or data to be used by other component (e.g., the processor 120 ) of the electronic device 101 , from the outside (e.g., a user) of the electronic device 101 . The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen).

The sound output device 155 may output sound signals to the outside of the electronic device 101 . The sound output device 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing record, and the receiver may be used for an incoming calls. According to an embodiment, the receiver may be implemented as separate from, or as part of the speaker.

The display device 160 may visually provide information to the outside (e.g., a user) of the electronic device 101 . The display device 160 may include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of the display, hologram device, and projector. According to an embodiment, the display device 160 may include touch circuitry adapted to detect a touch, or sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of force incurred by the touch.

The audio module 170 may convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 may obtain the sound via the input device 150 , or output the sound via the sound output device 155 or a headphone of an external electronic device (e.g., an electronic device 102 ) directly (e.g., wiredly) or wirelessly coupled with the electronic device 101 .

The sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101 , and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102 ) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

A connecting terminal 178 may include a connector via which the electronic device 101 may be physically connected with the external electronic device (e.g., the electronic device 102 ). According to an embodiment, the connecting terminal 178 may include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus which may be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electric stimulator.

The camera module 180 may capture a still image or moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to an embodiment, the battery 189 may include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.

The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and the external electronic device (e.g., the electronic device 102 , the electronic device 104 , or the server 108 ) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors that are operable independently from the processor 120 (e.g., the application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate with the external electronic device via the first network 198 (e.g., a short-range communication network, such as Bluetooth, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range communication network, such as a cellular network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multi components (e.g., multi chips) separate from each other. The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199 , using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196 .

The antenna module 197 may transmit or receive a signal or power to or from the outside (e.g., the external electronic device) of the electronic device 101 . According to an embodiment, the antenna module 197 may include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., PCB). According to an embodiment, the antenna module 197 may include a plurality of antennas. In such a case, at least one antenna appropriate for a communication scheme used in the communication network, such as the first network 198 or the second network 199 , may be selected, for example, by the communication module 190 (e.g., the wireless communication module 192 ) from the plurality of antennas. The signal or the power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197 .

At least some of the above-described components may be coupled mutually and communicate signals (e.g., commands or data) therebetween via an inter-peripheral communication scheme (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)).

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199 . Each of the electronic devices

102 and 104 may be a device of a same type as, or a different type, from the electronic device 101 . According to an embodiment, all or some of operations to be executed at the electronic device 101 may be executed at one or more of the external

electronic devices

102 , 104 , or 108 . For example, if the electronic device 101 should perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101 , instead of, or in addition to, executing the function or the service, may request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request may perform the at least part of the function or the service requested, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 101 . The electronic device 101 may provide the outcome, with or without further processing of the outcome, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, or client-server computing technology may be used, for example.

FIG. 2 is a block diagram illustrating an electronic device according to an embodiment of the present disclosure, FIG. 3 A is a block diagram illustrating a first communication module and a second communication module according to an embodiment of the present disclosure, and FIG. 3 B is a block diagram illustrating a first communication module and a second communication module according to another embodiment of the present disclosure. It shall be understood that term communication module as used in this document includes “transceiver.”

Referring to FIGS. 2 to 3 B , an electronic device 200 (e.g., the electronic device 101 ) according to an embodiment of the present disclosure may include at least one processor 210 (e.g., the processor 120 , hereinafter, shall be referred to as “processor”), a memory 220 (e.g., the memory 130 ), a display 230 (e.g., the display device 160 ), a first communication module 240 (e.g., the wireless communication module 192 ), a second communication module 250 (e.g., the wireless communication module 192 ), and a temperature sensor 260 (a temperature sensor 260 may include, among other things, a thermometer). The processor 210 , the memory 220 , the display 230 , the first communication module 240 , the second communication module 250 , and the temperature sensor 260 may be arranged within a housing (not shown) of the electronic device 200 . The housing may include a first plate and a second plate facing a direction opposite the direction of the first plate.

According to an embodiment of the present disclosure, the processor 210 may control handover between the first communication module 240 and the second communication module 250 . For example, the processor 210 may establish a first communication connection with an external electronic device using the first communication module 240 , and may perform wireless communication with the external electronic device through the first communication connection. For purposes of this document, “communication connection” includes a “communication link.” A “communication link” includes a wireless link. The processor 210 may monitor (e.g., identify, measure, or estimate) the temperature of the first communication module 240 when the first communication module 240 performs high-speed communication over a designated range (e.g., when the data throughput of the first communication module 240 is equal to or greater than a reference value). According to some embodiments, the processor 210 may monitor the temperature of the first communication module 240 while performing wireless communication with the external electronic device through the first communication connection.

The processor 210 may perform handover from the first communication module 240 to the second communication module 250 when the temperature of the first communication module 240 satisfies (e.g., is higher than (or exceeds)) a first designated temperature (a first reference temperature (e.g., 50 degrees C./122 degrees F.)). For example, the processor 210 may conditionally perform a handover, wherein a second communication connection is established that wirelessly communicates with the external electronic device using the second communication module 250 and the first communication connection is terminated shortly (a minimum amount of time required to verify and notify the external device) after the second communication connection is established, when the monitored (or identified) temperature satisfies the first reference temperature.

According to an embodiment, the processor 210 may conditionally perform the handover with the added condition that a received signal of the second communication module 250 is equal to or greater than (or exceeds) a designated reference electric field (e.g., −90 dBm). A method of monitoring the temperature of the first communication module 240 will be described later with reference to FIGS. 6 to 8 .

According to an embodiment of the present disclosure, the processor 210 may turn off the power of the first communication module 240 when performing handover from the first communication module 240 to the second communication module 250 . In another example, the processor 210 may reduce service quality (e.g., resolution) based on the performance (e.g., data throughput, data processing amount, or transmission speed) of the second communication module 250 . For example, the processor 210 may change from video data having 4K ultra high definition (UHD) image quality, which was transmitted using the first communication module 240 , to video data having full HD (FHD) image quality, and may transmit the converted video data to an external device (e.g., TV) using the second communication module 250 . According to an embodiment, the processor 210 may provide a user interface providing notification that the service quality has been changed due to the overheating of the electronic device 200 .

According to an embodiment of the present disclosure, the processor 210 may monitor the temperature of the first communication module 240 when performing handover to the second communication module 250 , and may perform handover from the second communication module 250 to the first communication module 240 when the temperature of the first communication module 240 satisfies (e.g., is equal to or lower than or below) a second designated temperature (a second reference temperature (e.g., 30 degrees C./88 degrees F.)), which is lower than the first designated temperature. According to an embodiment, the second reference temperature may be set equal to the first reference temperature. According to an embodiment, the processor 210 may perform handover from the second communication module 250 to the first communication module 240 when a received signal of the first communication module 240 is equal to or greater than (or exceeds) the designated reference electric field (e.g., −90 dBm).

According to an embodiment of the present disclosure, the processor 210 may restore the service quality when performing handover from the second communication module 250 to the first communication module 240 . For example, the processor 210 may transmit the video data with 4K UHD image quality, other than the video data with FHD image quality, to the external device using the first communication module 240 . According to an embodiment, the processor 210 may provide a user interface providing notification that handover from the second communication module 250 to the first communication module 240 has been performed.

According to an embodiments of the present disclosure, the reference temperature for the handover may be set differently for each application (app), function, or service. For example, even if the temperature of the first communication module 240 satisfies the first reference temperature during a designated app that a real-time communication is important (or required) is executing, the processor 210 does not perform handover to the second communication module 250 until a third designated temperature (a third reference temperature) (e.g., 60 degrees) is satisfied, and may communicate with the external electronic device via the first communication module 240 . The third reference temperature is equal to or greater than the first reference temperature.

According to an embodiments of the present disclosure, the processor 210 may not handover to the second communication module</fig

CLAIMS

Claims ( 20 )

What is claimed is:

1. A portable communication device comprising:

at least one communication module configured to transmit or receive a wireless signal corresponding to 5G communication and transmit or receive a wireless signal corresponding to 4G communication;

a temperature sensor;

at least one processor operatively coupled to the at least one communication module and the temperature sensor; and

memory operatively coupled to the at least one processor,

wherein the memory stores instructions that, when executed by the at least one processor, cause the portable communication device to perform a plurality of operations comprising:

causing the at least one communication module to establish a 5G data communication link between the portable communication device and a first communication network using the at least one communication module;

performing data communication via the 5G data communication link;

monitoring a temperature of the portable communication device using the temperature sensor; and

based at least in part on a determination that the temperature is higher than a specified value while a data throughput is maintained greater than a specified data throughput, releasing the 5G data communication link and performing the data communication via a 4G data communication link established between the portable communication device and a second communication network using the at least one communication module to control heat generation due to high-speed communication including the 5G communication.

2. The portable communication device of claim 1 , wherein the plurality of operations further comprises:

establishing another 5G data communication link using the at least one communication module based at least in part on a determination that the temperature is lower than the specified value after the 5G communication link is released.

3. The portable communication device of claim 1 , further comprising a display connected to the at least one processor, and wherein performing the data communication via the 5G data communication link comprises displaying on the display a first indication indicating that the data communication is being performed via the 5G data communication link; and wherein performing of the data communication via the 4G data communication link comprises displaying on the display a second indication indicating that the data communication is being performed via the 4G data communication link.

4. The portable communication device of claim 1 , wherein the at least one communication module comprises an array antenna.

5. The portable communication device of claim 4 , wherein performing data communication via the 5G data communication link comprises performing data communication using the array antenna.

6. The portable communication device of claim 4 , wherein the at least one communication module comprises another antenna.

7. The portable communication device of claim 6 , wherein performing the data communication via the 4G data communication link comprises performing data communication using the another antenna.

8. The portable communication device of claim 1 , wherein monitoring the temperature of the portable communication device comprises:

while the data throughput is maintained greater than the specified data throughput, continuing to perform the data communication via the 5G data communication link and monitoring the temperature of the portable communication device using the temperature sensor.

9. The portable communication device of claim 1 , wherein the data throughput is about at least in part of communication performed by the at least one communication module.

10. A method for performing data communication with a portable communication device, the method comprising:

establishing a 5G data communication link between the portable communication device and a first communication network using at least one communication module;

performing data communication via the 5G data communication link;

monitoring a temperature of the portable communication device using a temperature sensor; and

based at least in part on a determination that the temperature is higher than a specified value while a data throughput is maintained greater than a specified data throughput, releasing the 5G data communication link and performing the data communication via a 4G data communication link established between the portable communication device and a second communication network using the at least one communication module to control heat generation due to high-speed communication including the 5G communication.

11. The method of claim 10 , further comprising:

establishing another 5G data communication link using the at least one communication module based at least in part on a determination that the temperature is lower than the specified value after the 5G communication link is released.

12. The method of claim 10 , wherein performing the data communication via the 5G data communication link comprises displaying on a display a first indication indicating that the data communication is being performed via the 5G data communication link; and wherein performing of the data communication via the 4G data communication link comprises displaying on the display a second indication indicating that the data communication is being performed via the 4G data communication link.

13. The method of claim 10 , wherein the at least one communication module comprises an array antenna.

14. The method of claim 13 , wherein performing data communication via the 5G data communication link comprises performing data communication using the array antenna.

15. The method of claim 13 , wherein the at least one communication module comprises another antenna.

16. The method of claim 15 , wherein performing the data communication via the 4G data communication link comprises performing data communication using the another antenna.

17. A non-transitory computer readable medium storing a plurality of executable instructions, wherein execution of the plurality of executable instructions by at least one processor causes the at least one processor to perform a plurality of operations comprising:

establishing a 5G data communication link between a portable communication device and a first communication network using at least one communication module;

performing data communication via the 5G data communication link;

monitoring a temperature of the portable communication device using a temperature sensor; and

based at least in part on a determination that the temperature is higher than a specified value while a data throughput is maintained greater than a specified data throughput, releasing the 5G data communication link and performing the data communication via a 4G data communication link established between the portable communication device and a second communication network using the at least one communication module to control heat generation due to high-speed communication including the 5G communication.

18. The non-transitory computer readable medium of claim 17 , wherein the plurality of operations further comprises:

establishing another 5G data communication link using the at least one communication module based at least in part on a determination that the temperature is lower than the specified value after the 5G communication link is released.

19. The non-transitory computer readable medium of claim 17 , wherein performing the data communication via the 5G data communication link comprises displaying on a display a first indication indicating that the data communication is being performed via the 5G data communication link; and wherein performing of the data communication via the 4G data communication link comprises displaying on the display a second indication indicating that the data communication is being performed via the 4G data communication link.

20. The non-transitory computer readable medium of claim 17 , wherein performing data communication via the 5G data communication link comprises performing data communication using an array antenna.

US17/545,021

2017-11-24

2021-12-08

Electronic device and communication method using 4G and 5G communication based on temperature

Active

2039-09-04

US12192843B2

( en )

Priority Applications (1)

Application Number

Priority Date

Filing Date

Title

US17/545,021

US12192843B2

( en )

2017-11-24

2021-12-08

Electronic device and communication method using 4G and 5G communication based on temperature

Applications Claiming Priority (5)

Application Number

Priority Date

Filing Date

Title

KR10-2017-0158289

2017-11-24

KR1020170158289A

KR102402639B1

( en )

2017-11-24

2017-11-24

Electronic device and method for communicating thereof

US16/198,923

US11019548B2

( en )

2017-11-24

2018-11-23

Electronic device and communication method thereof

US17/326,525

US11218938B2

( en )

2017-11-24

2021-05-21

Electronic device and communication method thereof

US17/545,021

US12192843B2

( en )

2017-11-24

2021-12-08

Electronic device and communication method using 4G and 5G communication based on temperature

Related Parent Applications (1)

Application Number

Title

Priority Date

Filing Date

US17/326,525

Continuation

US11218938B2

( en )

2017-11-24

2021-05-21

Electronic device and communication method thereof

Publications (2)

Publication Number

Publication Date

US20220095193A1

US20220095193A1 ( en )

2022-03-24

US12192843B2

true

US12192843B2 ( en )

2025-01-07

Family

ID=66631649

Family Applications (3)

Application Number

Title

Priority Date

Filing Date

US16/198,923

Active

US11019548B2

( en )

2017-11-24

2018-11-23

Electronic device and communication method thereof

US17/326,525

Active

US11218938B2

( en )

2017-11-24

2021-05-21

Electronic device and communication method thereof

US17/545,021

Active

2039-09-04

US12192843B2

( en )

2017-11-24

2021-12-08

Electronic device and communication method using 4G and 5G communication based on temperature

Family Applications Before (2)

Application Number

Title

Priority Date

Filing Date

US16/198,923

Active

US11019548B2

( en )

2017-11-24

2018-11-23

Electronic device and communication method thereof

US17/326,525

Active

US11218938B2

( en )

2017-11-24

2021-05-21

Electronic device and communication method thereof

Country Status (9)

Country

Link

US

( 3 )

US11019548B2

( en )

EP

( 5 )

EP3825814B1

( en )

JP

( 2 )

JP2019097170A

( en )

KR

( 2 )

KR102402639B1

( en )

CN

( 3 )

CN115333568B

( en )

ES

( 3 )

ES2949234T3

( en )

HU

( 1 )

HUE059166T2

( en )

PL

( 1 )

PL3825814T3

( en )

WO

( 1 )

WO2019103527A1

( en )

Families Citing this family (24)

* Cited by examiner, † Cited by third party

Publication number

Priority date

Publication date

Assignee

Title

KR102402639B1

( en )

*

2017-11-24

2022-05-26

삼성전자주식회사

Electronic device and method for communicating thereof

US11493967B2

( en )

*

2018-06-01

2022-11-08

Interdigital Madison Patent Holdings, Sas

Thermal shutdown with hysteresis

KR102494515B1

( en )

2018-07-09

2023-02-01

삼성전자주식회사

Electronic device incuding glass plate

KR20210017030A

( en )

*

2019-08-06

2021-02-17

삼성전자주식회사

Electronic device for reducing power consumption and operating method thereof

US11659474B2

( en )

2019-03-27

2023-05-23

T-Mobile Usa, Inc.

Intelligent selection between singular and dual connectivity

WO2020204552A1

( en )

*

2019-04-04

2020-10-08

Samsung Electronics Co., Ltd.

Electronic device for reporting communication quality measurement result and method of operating the electronic device

KR102659415B1

( en )

*

2019-06-05

2024-04-22

삼성전자주식회사

Method for controlling a plurality of antenna modules and electronic device thereof

KR102785460B1

( en )

*

2019-07-22

2025-03-26

삼성전자주식회사

Electronic device and method for controlling data throughput based on overheat of the electronic device

WO2021045249A1

( en )

*

2019-09-04

2021-03-11

엘지전자 주식회사

Electronic device supporting heat mitigation and control method of same electronic device

WO2021045274A1

( en )

*

2019-09-06

2021-03-11

엘지전자 주식회사

Electronic device and control method of same electronic device

KR102891566B1

( en )

*

2019-09-10

2025-11-26

삼성전자 주식회사

Electronic device and method for implementing power and/or heat control

WO2021049794A1

( en )

2019-09-10

2021-03-18

삼성전자 주식회사

Method for implementing power and/or heat generation control and electronic device therefor

JP7007020B2

( en )

*

2019-10-16

2022-01-24

Ｎｅｃプラットフォームズ株式会社

Communication device, processing module execution control method and processing module execution control program

KR102806901B1

( en )

*

2019-11-11

2025-05-14

삼성전자 주식회사

Method for image processing based on message and electronic device implementing the same

WO2021187633A1

( en )

*

2020-03-17

2021-09-23

엘지전자 주식회사

Electronic device for supporting 5g communication and method for controlling electronic device

CN111399563B

( en )

*

2020-03-24

2021-10-19

Oppo广东移动通信有限公司

User terminal equipment

NL2025659B1

( en )

*

2020-05-25

2021-12-13

Microsoft Technology Licensing Llc

Intelligently selecting active transciver in a multi-transciver device

EP4006861A1

( en )

*

2020-11-30

2022-06-01

Koninklijke Philips N.V.

Monitoring system

CN113015226B

( en )

*

2021-02-24

2023-07-25

维沃移动通信有限公司

A network connection method and device

CN113852977A

( en )

*

2021-09-15

2021-12-28

李其中

A co-line transmission device for WIFI6 signal and 5G communication signal

KR20230049272A

( en )

*

2021-10-06

2023-04-13

삼성전자주식회사

Electronic device and method for improving thermal performance thereof

JP7171952B1

( en )

*

2022-02-16

2022-11-15

株式会社フジクラ

Wireless communication module output adjustment method, wireless communication module manufacturing method, and wireless communication module output adjustment device

EP4355016A4

( en )

*

2022-08-30

2024-10-16

Samsung Electronics Co., Ltd.

ELECTRONIC DEVICE FOR SWITCHING CELLULAR COMMUNICATION BASED ON STATE OF ELECTRONIC DEVICE, AND METHOD FOR OPERATING ELECTRONIC DEVICE

WO2025263932A1

( en )

*

2024-06-17

2025-12-26

삼성전자 주식회사

Electronic device, operation method thereof, and storage medium

Citations (246)

* Cited by examiner, † Cited by third party

Publication number

Priority date

Publication date

Assignee

Title

KR19980015050A

( en )

1996-08-19

1998-05-25

김종진

Electrolytic chromate treatment method of galvanized steel sheet

KR19990026912A

( en )

1997-09-26

1999-04-15

이구택

Coating composition for forming insulating film and method of forming insulating film of non-oriented electrical steel sheet using same

KR19990048923A

( en )

1997-12-11

1999-07-05

이구택

Pickling method of ferritic stainless steel

KR19990051958A

( en )

1997-12-20

1999-07-05

이구택

METHOD FOR MANUFACTURING METALIZED ZINC PLATED STEEL SHEET

KR19990053139A

( en )

1997-12-23

1999-07-15

이구택

Electrolytic chromate treatment method of galvanized steel sheet excellent in whiteness

KR19990061723A

( en )

1997-12-31

1999-07-26

토마스 더블유. 버크맨

Stamping foil

JPH11275171A

( en )

1998-03-20

1999-10-08

Toshiba Corp

Transmission rate control method for software defined radio

JP2001357369A

( en )

2000-06-13

2001-12-26

Denso Corp

IC chips for mounting IC cards, etc.

JP2002531023A

( en )

1998-11-20

2002-09-17

エリクソン インコーポレイテッド

Transmission Control by Temperature in Wireless Data Modem

US6892312B1

( en )

2001-10-30

2005-05-10

Lsi Logic Corporation

Power monitoring and reduction for embedded IO processors

US20060003083A1

( en )

2004-01-14

2006-01-05

Ajinomoto Co. Inc

Food containing glycine and use thereof

KR20060049331A

( en )

2004-10-28

2006-05-18

스미또모 가가꾸 가부시끼가이샤

Resin composition, foam molding and laminate

JP2006165860A

( en )

2004-12-06

2006-06-22

Fujitsu Ten Ltd

Antenna amplifier and antenna amplifier system

JP2006245862A

( en )

2005-03-02

2006-09-14

Nec Corp

Wireless communication terminal

KR20070072038A

( en )

2005-12-30

2007-07-04

주식회사 효성

Polyester fiber with excellent adhesion to polyvinyl chloride and its manufacturing method

KR20070089820A

( en )

2004-11-29

2007-09-03

도레이 필름 카코우 가부시키가이샤

Polypropylene film and laminate

KR20070102994A

( en )

2004-11-02

2007-10-22

에이치티세라믹스 에스.에이.

Solid oxide fuel cell system

KR20070113216A

( en )

2005-03-17

2007-11-28

데이진 가부시키가이샤

Electrolyte membrane

KR20070121807A

( en )

2005-03-29

2007-12-27

브리티쉬 아메리칸 토바코 (인베스트먼츠) 리미티드

Porous carbon material and smoking articles containing the carbon material and smoke filters thereof

KR20070121729A

( en )

2005-04-12

2007-12-27

교와 핫꼬 고교 가부시끼가이샤

Preparation of Amino Acids

KR20080028453A

( en )

2005-06-30

2008-03-31

디에스엠 아이피 어셋츠 비.브이.

Ballistic resistant products

KR20080044853A

( en )

2005-09-15

2008-05-21

인 숙 유 인터내셔널 프로젝트 매니지먼트 - 아이피ì—

Table tennis ball without celluloid

KR20080052554A

( en )

2005-10-07

2008-06-11

하마마츠 포토닉스 가부시키가이샤

X-ray tube and nondestructive testing device

KR20080061155A

( en )

2006-12-28

2008-07-02

주식회사 효성

Industrial high strength polyethylene terephthalate fiber with excellent thermal properties

KR20080061899A

( en )

2006-12-28

2008-07-03

주식회사 효성

Polyester fiber with excellent adhesion to polyvinyl chloride and its manufacturing method

KR20080089343A

( en )

2005-12-22

2008-10-06

닛신 오일리오그룹 가부시키가이샤

Soy milk and its manufacturing method

JP2008244603A

( en )

2007-03-26

2008-10-09

Sony Ericsson Mobilecommunications Japan Inc

Radio communication terminal and radio communication method

KR20080104703A

( en )

2007-05-29

2008-12-03

주식회사 코오롱

Polyester hollow fiber with excellent tear strength and abrasion resistance and its manufacturing method

KR20080114737A

( en )

2006-03-13

2008-12-31

보레알리스 테크놀로지 오와이.

High density polyethylene

KR20090019734A

( en )

2007-08-21

2009-02-25

히다치 막셀 가부시키가이샤

Non-aqueous secondary battery

KR20090049597A

( en )

2006-09-11

2009-05-18

세키스이가가쿠 고교가부시키가이샤

Patch

KR20100015949A

( en )

2007-04-28

2010-02-12

킴벌리-클라크 월드와이드, 인크.

Absorbent composite showing stepped dose behavior

KR20100023950A

( en )

2007-06-06

2010-03-04

데비오 레쉑쉐 빠르마슈띠끄 에스.아

Slow release pharmaceutical composition made of microparticles

US20100112936A1

( en )

2007-09-20

2010-05-06

Alf Friman

Tunable antennas for mobile handsets

KR20100051033A

( en )

2008-11-06

2010-05-14

니찌아스 카부시키카이샤

Base material for disk, process for producing the same, and disk roll

KR20100087145A

( en )

2007-10-03

2010-08-03

세브 에스.아.

Portable appratus for the steam treatment of hair

CN101848518A

( en )

2010-06-10

2010-09-29

中兴通讯股份有限公司

Dual-mode wireless terminal and switching method thereof

KR20100105581A

( en )

2007-11-30

2010-09-29

제이엑스 닛코닛세키에너지주식회사

Method for transporting fluid catalytic cracking catalyst

US20100273517A1

( en )

2008-10-24

2010-10-28

Interdigital Patent Holdings, Inc.

Method and apparatus for component temperature control based on reduction of data rate and wtru transmit power

KR20110009857A

( en )

2009-07-23

2011-01-31

엘지이노텍 주식회사

Manufacturing method of liquid crystal display device and antireflection layer

KR20110035981A

( en )

2009-09-30

2011-04-06

가시오게산키 가부시키가이샤

An image processing apparatus, an image processing method, and a storage medium

KR20110044375A

( en )

2009-10-23

2011-04-29

주식회사 휘닉스소재

Method for producing lithium-nickel-cobalt-manganese composite oxide, lithium-nickel-cobalt-manganese composite oxide prepared thereby and lithium secondary battery comprising same

KR20110073992A

( en )

2009-12-24

2011-06-30

주식회사 효성

Polyethylene terephthalate fiber for airbag and fabric using same

KR20110076140A

( en )

2009-12-29

2011-07-06

주식회사 효성

Polyethylene terephthalate fiber for airbag and fabric using same

KR20110078137A

( en )

2009-12-30

2011-07-07

주식회사 효성

High performance radial tires

KR20110082285A

( en )

2010-01-11

2011-07-19

동우 화인켐 주식회사

Polarizer

KR20110083590A

( en )

2008-08-19

2011-07-20

미노루 칸노

Materials, methods and fruits and vegetables related to sugar improvement, sugar content adjustment and taste adjustment

JP2011155589A

( en )

2010-01-28

2011-08-11

Hitachi Ltd

Hybrid communication terminal, and program

KR20110108896A

( en )

2010-03-30

2011-10-06

동의대학교 산학협력단

Single Crystal Growth Method and Single Crystal Raw Material

KR20110132237A

( en )

2010-05-31

2011-12-07

캐논 가부시끼가이샤

Recording medium

KR20110133638A

( en )

2006-08-21

2011-12-13

니폰 쇼쿠바이 컴파니 리미티드

Microparticles | fine-particles, the manufacturing method of microparticles | fine-particles, the resin composition containing this microparticle, and an optical film

KR20110136415A

( en )

2010-06-15

2011-12-21

(주)짜임

Manufacturing method of pure grain bread and premix to make same

KR20110136989A

( en )

2010-06-16

2011-12-22

김은호

Scented salt manufacturing method

KR20120004612A

( en )

2010-07-07

2012-01-13

이형대

Yakju manufacturing method using raw horse

KR20120020865A

( en )

2010-08-31

2012-03-08

김경환

Method of processing fried chichen with ginseng and other supplements

KR20120022943A

( en )

2009-05-15

2012-03-12

메이덴샤 코포레이션

Device for measuring displacement of pantograph and method for detecting hard spot of trolley wire

US20120075992A1

( en )

2010-09-24

2012-03-29

Qualcomm, Incorporated

Methods and apparatus for touch temperature management based on power dissipation history

KR20120032528A

( en )

2009-06-18

2012-04-05

도레이 카부시키가이샤

Down proof woven fabric

KR20120041303A

( en )

2010-10-21

2012-05-02

조선대학교산학협력단

The manufacture method of sun-dried salt kimchi beverage and the kimchi beverage

KR20120041824A

( en )

2010-08-27

2012-05-03

이기흥

King crab preserved in soy sauce and manufacturing process of the same

KR20120047451A

( en )

2010-11-04

2012-05-14

강원대학교산학협력단

Mobile terminal for performing vertical handover in heterogeneous networks and handover method using the same

KR20120051376A

( en )

2010-11-12

2012-05-22

대한유화공업 주식회사

Polypropylene compositions having excellent impact-resistance and press-resistance

KR20120064170A

( en )

2010-12-09

2012-06-19

(주)풀무원홀딩스

Method for increasing aromatic compounds in cultured wild ginseng using the picrasma quassioides benn bark extract

KR20120068374A

( en )

2010-12-17

2012-06-27

홍성길

Manufacturing method for fried tuna

KR20120070349A

( en )

2010-12-21

2012-06-29

(주)애드파인테크놀러지

Polishing method of blackmatrix printing surface of glass substrate printed blackmatrix and glass substrate printed blackmatrix manufactured using the same

KR20120074752A

( en )

2010-12-28

2012-07-06

주식회사 포스코

Method for reducing fine coke particles in cokes oven gas

KR20120076096A

( en )

2010-12-29

2012-07-09

동신대학교산학협력단

Jean for fabrics dyeing method use natural indigo powder

KR20120078132A

( en )

2010-12-31

2012-07-10

한국과학기술원

Method for supplying knowledge service and system of the same

KR20120081866A

( en )

2011-01-12

2012-07-20

최청

A method of fermented soybean paste using aspergillys sp. , and bacillus sp. and the product thereby

KR20120123171A

( en )

2011-04-19

2012-11-08

티아크 가부시키가이샤

Load cell unit

US20120281558A1

( en )

2011-05-03

2012-11-08

Jon James Anderson

Temperature-driven airlink selection in a multi-mode wireless device

KR101203120B1

( en )

2012-04-26

2012-11-21

(주) 성일

Coating Solution for salt damage protection and salt damage protection filter and salt damage protection filter membrane thereof

KR20120129519A

( en )

2011-05-20

2012-11-28

조부현

Method for culturing rhizopus microsporus var oliggosporus using rice

KR20120130268A

( en )

2010-03-30

2012-11-29

다이와보 폴리텍 가부시키가이샤

Polyolefin-based split-type conjugate fibre, fibrous mass and cell separator using same, and production method for same

KR101207163B1

( en )

2011-07-08

2012-11-30

농업회사법인 주식회사 제이팜스

The method of making low-fat egg white compositions

KR20120134497A

( en )

2011-06-02

2012-12-12

에스비리모티브 주식회사

Positive electrode for rechargeable lithium battery and rechargeable lithium battery including same

KR20120135417A

( en )

2010-03-31

2012-12-13

가부시키가이샤 고베 세이코쇼

Black metal sheet

KR20130001770A

( en )

2011-06-28

2013-01-07

호남석유화학 주식회사

Polypropylene resin composition for high tenacity fiber and high tenacity fiber manufactured by using the same

KR101222743B1

( en )

2011-10-11

2013-01-15

송미정

Method for manufacturing leaf mustard soap and manufactured leaf mustard soap by that method

KR101224125B1

( en )

2012-05-31

2013-01-21

김성수

A manufacturing method of conductive nylon fiber

KR20130011558A

( en )

2011-07-22

2013-01-30

신광식

Automatic dipping machine for soldering bobbin

KR20130012656A

( en )

2011-07-26

2013-02-05

(주)블루ì—

Sauce of rice cake and it&#39;s manufacturing method

KR101241300B1

( en )

2012-06-22

2013-03-13

김병국

Herbicidal composite

<span itempr

Related documents

• Big data-based autonomous flight drone system and autonomous flight method … — Rgblab Co., Ltd. (US20210390867A1)#653964
• Generating augmented reality experiences utilizing physical objects to … — Meta Platforms Technologies, Llc (US20260037214A1)#653960
• Virtual reality system using multiple force arrays for a solver — DeepMotion, Inc. (US10657696B2)#653961
• Tracking position of device inside-out for virtual reality interactivity — Sony Interactive Entertainment America Llc (US10535153B2)#653962
• Augmented reality system with spatialized audio tied to user manipulated … — Magic Leap, Inc. (US11231770B2)#653963