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Electronic device comprising 5G antenna — Lg Electronics Inc. (US11929564B2)

Lg Electronics Inc. · Google Patents

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lgelectronicsinc.

patent, google patents, intellectual property, US11929564B2, Lg Electronics Inc., Seungmin WOO, en, 2024

ABSTRACT

Abstract

Provided is an electronic device comprising an antenna for 5G communication according to the present invention. The electronic device comprises an array antenna which is implemented as a multi-layer substrate inside the electronic device and includes multiple antenna elements. Each of the multiple antenna elements of the array antenna may comprise: a patch antenna disposed on a specific layer of the multi-layer substrate and including a first patch and a second patch which are spaced a predetermined distance apart from each other; and a ground layer disposed under the patch antenna and having a slot. Meanwhile, the first patch and the second patch may be connected to the ground layer through multiple vias, and the multiple vias may be arranged in the longitudinal direction of the slot while being adjacent to the slot.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is the National Stage filing under 35 U.S.C. 371 of International Application No. PCT/KR2019/014421, filed on Oct. 30, 2019, the contents of which are all incorporated by reference herein in their entirety.

TECHNICAL FIELD

The present disclosure relates to an electronic device having a 5G antenna. One particular implementation relates to an electronic device having a 5G array antenna operating in a millimeter wave band.

BACKGROUND ART

Electronic devices may be divided into mobile/portable terminals and stationary terminals according to mobility. Also, the electronic device may be classified into handheld types and vehicle mount types according to whether or not a user can directly carry.

Functions of electronic devices are diversified. Examples of such functions include data and voice communications, capturing images and video via a camera, recording audio, playing music files via a speaker system, and displaying images and video on a display. Some terminals include additional electronic game play functions or perform a multimedia player function. Specifically, in recent years, mobile terminals can receive broadcast and multicast signals to allow viewing of video or television programs.

As it becomes multifunctional, an electronic device can be allowed to capture still images or moving images, play music or video files, play games, receive broadcast and the like, so as to be implemented as an integrated multimedia player.

Efforts are ongoing to support and increase the functionality of electronic devices. Such efforts include software and hardware improvements, as well as changes and improvements in the structural components.

In addition to those attempts, the electronic devices provide various services in recent years by virtue of commercialization of wireless communication systems using an LTE communication technology. Also, it is expected that in the future, wireless communication systems using 5G communication technology will be commercialized to provide a variety of services. Meanwhile, some of LTE frequency bands may be allocated to provide 5G communication services.

In this regard, the electronic device may be configured to provide 5G communication services in various frequency bands. Recently, attempts have been made to provide 5G communication services using a Sub-6 band below a 6 GHz band. In the future, it is also expected to provide 5G communication services by using a millimeter wave (mmWave) band in addition to the Sub-6 band for faster data rate.

Meanwhile, a 28 GHz band, a 39 GHz band, and a 64 GHz band are being considered as frequency bands to be allocated for 5G communication services in such a mmWave band. In this regard, a plurality of array antennas in the millimeter wave band may be disposed in the electronic device.

Meanwhile, in addition to the plurality of array antennas, a plurality of other antennas may be disposed in the electronic device. Therefore, it is necessary to radiate a signal to an outside of the electronic device while preventing interference with the plurality of existing antennas.

In this regard, a 5G antenna disposed inside the electronic device may be fabricated in a printed form on a planar substrate. Such an antenna printed on a planar substrate radiates a signal in a direction perpendicular to the substrate. Accordingly, there is a problem in that the signal radiated from the 5G antenna disposed inside the electronic device may be blocked by a display region or a metal body of the electronic device.

In particular, a millimeter wave band such as a 64 GHz band may be allocated for 5G/6G communication services. An antenna operating in such a 64 GHz band needs to operate particularly in a broadband. In addition, antennas operating in other mmWave bands also need to operate in a broadband for high-speed communication. However, the antenna printed on the planar substrate has a problem in that bandwidth characteristics are limited due to the planar structure.

DISCLOSURE OF INVENTION

Technical Problem

An aspect of the present disclosure is to solve the above-mentioned problems and other problems. Furthermore, another aspect of the present disclosure is to improve the radiation performance of a 5G antenna in an electronic device having a 5G/6G antenna operating in a millimeter wave band.

Another aspect of the present disclosure is to achieve the broadband characteristics of a 5G antenna in the electronic device having the 5G/6G antenna operating in a millimeter wave band.

Still another aspect of the present disclosure is to radiate a signal to an outside of the electronic device through a non-metal region through the antenna in the electronic device having the 5G/6G antenna operating in a millimeter wave band.

Solution to Problem

In order to achieve the foregoing or other objectives, an electronic device having an antenna for 5G communication according to the present disclosure is provided. The electronic device may include an array antenna implemented as a multi-layer substrate inside the electronic device, the array antenna including a plurality of antenna elements. Each antenna element of the plurality of array antennas may include a patch antenna disposed on a specific layer of the multi-layer substrate, the patch antenna including a first patch and a second patch spaced apart from each other by a predetermined spacing, and a patch antenna disposed on a specific layer of the multi-layer substrate, the patch antenna including a first patch and a second patch spaced apart from each other by a predetermined spacing, and a ground layer disposed under the patch antenna, the ground layer having a slot. On the other hand, the first patch and the second patch may be connected to the ground layer through a plurality of vias, and the plurality of vias may be disposed in a length direction of the slot to be adjacent to the slot.

According to an embodiment, the electronic device may further include a transceiver circuit that controls a signal applied to each antenna element of the array antenna to perform beamforming through the array antenna.

According to an embodiment, each of the antenna elements may operate as a magnetic dipole type slot antenna by a magnetic field formed in a second slot between the first patch and the second patch in a first frequency band. Furthermore, the each of the antenna elements may operate as an electric dipole type patch antenna by the first patch and the second patch in a second frequency band different from the first frequency band.

According to an embodiment, the plurality of vias may include a plurality of first vias disposed at predetermined intervals on one side surface of the first patch to connect the one side surface of the first patch and the ground layer. Furthermore, the plurality of vias may further include a plurality of second vias disposed at predetermined intervals on one side surface of the first patch to connect the ground layer and the other side surface of the second patch facing the one side surface of the first patch.

According to an embodiment, the electronic device may further include a feeding line disposed under the ground layer, and configured to transmit a signal to the patch antenna through the slot. In this case, a first signal of a first frequency band may form a magnetic field through a second slot between the first patch and the second patch through the feeding line and the plurality of vias. Meanwhile, a second signal of a second frequency band may be coupled to the patch antenna through the feeding line and the slot to form an electric field on the patch antenna.

According to an embodiment, a radio frequency integrated chip (RFIC), which is the transceiver circuit, may be connected to the feeding line in the form of bumping under the feeding line to transmit a millimeter wave band signal between the RFIC and the feeding line.

According to an embodiment, the ed the ed may further include a parasitic patch disposed on a substrate above the patch antenna to extend an operating bandwidth of the antenna element. In this case, as the center of the parasitic patch is offset compared to the center of the patch antenna, a beam peak of the antenna element may be tilted by a first angle from the boresight.

According to an embodiment, the electronic device may further include a second parasitic patch disposed above the parasitic patch to further extend the operating bandwidth of the antenna element. In this case, as the center of the second parasitic patch is offset compared to the center of the parasitic patch, the beam peak of the antenna element may be tilted by a second angle greater than the first angle from the boresight.

According to an embodiment, the multi-layer substrate may be disposed inside a body of the electronic device. Meanwhile, the body may include a metal region defined at a side surface portion of the electronic device, and disposed to disallow a signal radiated from the antenna element to pass therethrough, and an un-transparent region defined at a front or rear surface portion of the electronic device to disallow a signal radiated from the antenna element to pass therethrough. Meanwhile, the multi-layer substrate may include a dielectric region defined between the side metal region and the un-transparent region and disposed to allow a signal radiated from the antenna element to pass therethrough.

According to an embodiment, the array antenna may be configured as a one-dimensional array antenna such that a predetermined number of antenna elements are disposed in one axial direction to perform beamforming in the one axial direction. Accordingly, a beam-formed signal may be radiated from the array antenna to the outside through a curved dielectric region defined in the body of the electronic device.

According to an embodiment, the array antenna may be configured as a two-dimensional array antenna in which a predetermined number of antenna elements are disposed in one axial direction and a predetermined number of antenna elements are disposed in the other axial direction. Meanwhile, a beam-formed signal may be radiated from the array antenna to the outside through a curved second dielectric region defined in the body of the electronic device. Meanwhile, a width of the second dielectric region is disposed to be narrower than that of the dielectric region due to the directivity of the two-dimensional array antenna in the other axial direction.

According to an embodiment, the patch antenna may include first to fourth patches spaced apart in one axial direction and the other axial direction. Meanwhile, the ground layer may have an orthogonal slot disposed to be orthogonal to the one axial direction and the other axial direction. As an example, the plurality of vias may be disposed along vertical and horizontal side surfaces in each of the first to fourth patches adjacent to the orthogonal slot such that each of the antenna elements forms a dual polarization.

According to an embodiment, the electronic device may further include a first feeding line disposed in parallel to a vertical slot of the orthogonal slot under the ground, and a second feeding line disposed in parallel to a horizontal slot of the orthogonal slot under the ground. Accordingly, the each of the antenna elements may generate a vertically polarized signal by a first signal from the first feeding line. Furthermore, the each of the antenna elements may generate a horizontally polarized signal by a second signal from the second feeding line.

According to an embodiment, the array antenna may be configured as a two-dimensional array antenna in which a predetermined number of antenna elements are disposed in one axial direction and a predetermined number of antenna elements are disposed in the other axial direction. Meanwhile, a direction of the slot may be defined in the same direction for all antenna elements. Furthermore, a plurality of electric band gap (EBG) structures may be periodically disposed on the ground and a substrate on which the patch antenna is disposed in the multi-layer substrate in a length direction of the slot so as to improve the efficiency of the array antenna.

According to an embodiment, the plurality of EBG structures may be disposed in a one-dimensional structure on both side surfaces of the multi-layer substrate in a structure ground-connected to the substrate on which the patch antenna is disposed. Meanwhile, a plurality of EBG vias, which are connection structures disposed on the EBG structures, may be arranged in parallel to the plurality of vias arranged in the patch antenna to improve antenna efficiency.

According to an embodiment, the electronic device may further include a baseband processor connected to the transceiver circuit and configured to control the transceiver circuit so as to perform beamforming and multi-input multi-output (MIMO) through a plurality of array antennas disposed at different positions of the electronic device. Meanwhile, the baseband processor may perform beamforming in different directions to radiate signals to dielectric regions defined in different directions through a first array antenna and a second array antenna among the plurality of array antennas. As a result, it may be possible to improve an isolation between a plurality of MIMO streams.

An electronic device having an antenna according to another aspect of the present disclosure is provided. The electronic device may include an array antenna implemented as a multi-layer substrate inside the electronic device, the array antenna including a plurality of antenna elements, a case constituting a body of the electronic device and having a dielectric region to allow a signal through the array antenna to be radiated to the outside, and a processor that controls a signal applied to each antenna element of the array antenna to perform beamforming through the array antenna.

According to an embodiment, each of the antenna elements may include a patch antenna disposed on a specific layer of the multi-layer substrate, the patch antenna comprising a first patch and a second patch spaced apart from each other by a predetermined spacing, and a ground layer disposed under the patch antenna, the ground layer having a slot. Meanwhile, the first patch and the second patch may be connected to the ground layer through a plurality of vias, and the plurality of vias are disposed in a length direction of the slot to be adjacent to the slot.

Advantageous Effects of Invention

An aspect of the present disclosure is to improve the radiation performance of a 5G antenna through the antenna with a multi-layer substrate structure, a via in a slot region, and an EBG structure in an electronic device having a 5G/6G antenna operating in a millimeter wave band.

Furthermore, another aspect of the present disclosure is to achieve the broadband characteristics of a 5G antenna by having the characteristics of both a slot antenna and a patch antenna using vias in the electronic device having the 5G/6G antenna operating in a millimeter wave band.

Still another aspect of the present disclosure is to radiate a signal to an outside of the electronic device through a non-metal region through an antenna by adjusting the position of a parasitic patch in the electronic device having the 5G/6G antenna operating in a millimeter wave band.

Further scope of applicability of the present disclosure will become apparent from the following detailed description. It should be understood, however, that the detailed description and specific examples, such as the preferred embodiment of the disclosure, are given by way of illustration only, since various changes and modifications within the spirit and scope of the disclosure will be apparent to those skilled in the art.

BRIEF DESCRIPTION OF DRAWINGS

CROSS-REFERENCE TO RELATED APPLICATIONS

TECHNICAL FIELD

BACKGROUND ART

DISCLOSURE OF INVENTION

Technical Problem

Another aspect of the present disclosure is to achieve the broadband characteristics of a 5G antenna in the electronic device having the 5G/6G antenna operating in a millimeter wave band.

Solution to Problem

According to an embodiment, the array antenna may be configured as a two-dimensional array antenna in which a predetermined number of antenna elements are disposed in one axial direction and a predetermined number of antenna elements are disposed in the other axial direction. Meanwhile, a direction of the slot may be defined in the same direction for all antenna elements. Furthermore, a plurality of electric band gap (EBG) structures may be periodically disposed on the ground and a substrate on which the patch antenna is disposed in the multi-layer substrate in a length direction of the slot so as to improve the efficiency of the array antenna.

Advantageous Effects of Invention

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 A is a block diagram of an electronic device in accordance with one exemplary implementation of the present disclosure, and FIGS. 1 B and 1 C are conceptual views illustrating one example of an electronic device, viewed from different directions.

FIG. 2 is a block diagram illustrating a configuration of a wireless communication unit of an electronic device operable in a plurality of wireless communication systems according to an implementation.

FIG. 3 is an example showing a configuration in which a plurality of antennas of an electronic device according to the present disclosure can be arranged.

FIG. 4 shows a side view of a broadband antenna implemented on a multi-layer substrate according to the present disclosure.

FIG. 5 A shows a perspective view of the broadband antenna implemented on a multi-layer substrate according to the present disclosure. FIG. 5 B shows a structure in which a patch antenna is connected to a ground adjacent to a slot by a via in the broadband antenna implemented on a multi-layer substrate according to the present disclosure. FIG. 5 C shows a front view of the broadband antenna implemented on a multi-layer substrate according to the present disclosure.

FIGS. 6 A to 6 C show an array antenna structure operable in a millimeter wave band according to the present disclosure.

FIG. 7 shows return loss characteristics measured in each antenna element of an array antenna according to the present disclosure.

FIG. 8 shows an operation principle in different bands in a structure in which a plurality of vias are disposed at predetermined intervals on an inner boundary of a patch antenna according to the present disclosure.

FIG. 9 illustrates a broadband antenna structure and an electronic device body structure disposed on a multi-layer substrate further including a parasitic patch according to an embodiment of the present disclosure.

FIGS. 10 A to 10 C show front views for each layer of a single antenna element having a dual feeding structure according to the present disclosure.

FIGS. 11 A to 11 D show a perspective view and front views for each layer of a broadband antenna structure in which a plurality of vias having a dual feeding structure according to the present disclosure are disposed adjacent to an inner slot.

FIG. 12 shows an array antenna configuration in which a plurality of vias are disposed in a patch adjacent to a slot according to the present disclosure.

FIG. 13 shows array antenna configuration to which an electric band gap (EBG) structure, which is a periodic grating structure for improving radiation performance according to the present disclosure, is applied.

FIG. 14 shows a configuration of an electronic device having a processor that controls an array antenna disposed with a plurality of via structures according to the present disclosure to radiate signals through a case.

MODE FOR THE INVENTION

Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, and the same or similar elements are designated with the same numeral references regardless of the numerals in the drawings and redundant description thereof will be omitted. In general, a suffix such as âmoduleâ and âunitâ may be used to refer to elements or components. Use of such a suffix herein is merely intended to facilitate description of the specification, and the suffix itself is not intended to give any special meaning or function. In describing the present disclosure, moreover, the detailed description will be omitted when a specific description for publicly known technologies to which the invention pertains is judged to obscure the gist of the present disclosure. The accompanying drawings are used to help easily understand the technical idea of the present disclosure and it should be understood that the idea of the present disclosure is not limited by the accompanying drawings. The idea of the present disclosure should be construed to extend to any alterations, equivalents and substitutes besides the accompanying drawings.

It will be understood that although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are generally only used to distinguish one element from another.

It will be understood that when an element is referred to as being âconnected withâ another element, the element can be connected with the another element or intervening elements may also be present. In contrast, when an element is referred to as being âdirectly connected withâ another element, there are no intervening elements present.

A singular representation may include a plural representation unless it represents a definitely different meaning from the context.

Terms such as âincludeâ or âhasâ are used herein and should be understood that they are intended to indicate an existence of several components, functions or steps, disclosed in the specification, and it is also understood that greater or fewer components, functions, or steps may likewise be utilized.

Electronic devices presented herein may be implemented using a variety of different types of terminals. Examples of such devices include cellular phones, smart phones, user equipment, laptop computers, digital broadcast terminals, personal digital assistants (PDAs), portable multimedia players (PMPs), navigators, portable computers (PCs), slate PCs, tablet PCs, ultra-books, wearable devices (for example, smart watches, smart glasses, head mounted displays (HMDs)), and the like.

However, it may be easily understood by those skilled in the art that the configuration according to the exemplary embodiments of this specification can also be applied to stationary terminals such as digital TV, desktop computers, digital signages, and the like, excluding a case of being applicable only to the mobile terminals.

Referring to FIGS. 1 A to 1 C , FIG. 1 A is a block diagram of an electronic device in accordance with one exemplary implementation of the present disclosure, and FIGS. 1 B and 1 C are conceptual views illustrating one example of an electronic device, viewed from different directions.

The electronic device 100 may be shown having components such as a wireless communication unit 110 , an input unit 120 , a sensing unit 140 , an output unit 150 , an interface unit 160 , a memory 170 , a controller 180 , and a power supply unit 190 . It is understood that implementing all of the illustrated components is not a requirement. Greater or fewer components may alternatively be implemented.

In more detail, among others, the wireless communication unit 110 may typically include one or more modules which permit communications such as wireless communications between the electronic device 100 and a wireless communication system, communications between the electronic device 100 and another electronic device, or communications between the electronic device 100 and an external server. Further, the wireless communication unit 110 may typically include one or more modules which connect the electronic device 100 to one or more networks. Here, the one or more networks may be, for instance, a 4G communication network and a 5G communication network.

The wireless communication unit 110 may include at least one of a 4G wireless communication module 111 , a 5G wireless communication module 112 , a short-range communication module 113 , a location information module 114 and the like.

The 4G wireless communication module 111 may transmit and receive 4G signals to and from 4G base stations through a 4G mobile communication network. At this time, the 4G wireless communication module 111 may transmit one or more 4G transmission signals to the 4G base station. Furthermore, the 4G wireless communication module 111 may receive one or more 4G reception signals from the 4G base station.

In this regard, up-link (UL) multi-input multi-output (MIMO) may be performed by a plurality of 4G transmission signals transmitted to the 4G base station. Furthermore, down-link (DL) multi-input multi-output (MIMO) may be performed by a plurality of 4G reception signals received from the 4G base station.

The 5G wireless communication module 112 may transmit and receive 5G signals to and from 5G base stations through a 5G mobile communication network. Here, the 4G base station and the 5G base station may have a non-stand-alone (NSA) structure. For instance, the 4G base station and the 5G base station may have a co-located structure disposed at the same location within a cell. Alternatively, the 5G base station may be deployed in a stand-alone (SA) structure at a separate location from the 4G base station.

The 5G wireless communication module 112 may transmit and receive 5G signals to and from 5G base stations through a 5G mobile communication network. At this time, the 5G wireless communication module 112 may transmit one or more 5G transmission signals to the 5G base station. Furthermore, the 5G wireless communication module 112 may receive one or more 5G reception signals from the 5G base station.

In this case, a 5G frequency band may use the same band as a 4G frequency band, and it may be referred to as LTE re-farming. Meanwhile, a Sub-6 frequency band, which is a range of 6 GHz or less, may be used as the 5G frequency band.

On the contrary, a millimeter wave (mmWave) band may be used as a 5G frequency band to perform broadband high-speed communication. When the mmWave band is used, the electronic device 100 may perform beamforming for communication coverage expansion with a base station.

Meanwhile, regardless of the 5G frequency band, in a 5G communication system, a larger number of multi-input multi-output (MIMO) may be supported to improve transmission speed. In this regard, up-ink (UL) MIMO may be performed by a plurality of 5G transmission signals transmitted to the 5G base station. Furthermore, down-link (DL) MIMO may be performed by a plurality of 5G reception signals received from the 5G base station.

Meanwhile, the wireless communication unit 110 may be in a dual connectivity (DC) state with a 4G base station and a 5G base station through the 4G wireless communication module 111 and the 5G wireless communication module 112 . As such, the dual connectivity with the 4G base station and the 5G base station may be referred to as EUTRAN NR DC (EN-DC). Here, EUTRAN is an abbreviated form of âEvolved Universal Telecommunication Radio Access Networkâ, and refers to a 4G wireless communication system. Also, NR is an abbreviated form of âNew Radioâ and refers to a 5G wireless communication system.

On the other hand, when the 4G base station and the 5G base station have a co-located structure, it is possible to improve throughput through inter-CA (Carrier Aggregation). Therefore, in an EN-DC state with the 4G base station and the 5G base station, 4G reception signals and 5G reception signals may be simultaneously received through the 4G wireless communication module 111 and the 5G wireless communication module 112 .

The short-range communication module 113 is configured to facilitate short-range communications. Suitable technologies for implementing such short-range communications include BLUETOOTHâ¢, Radio Frequency IDentification (RFID), Infrared Data Association (IrDA), Ultra-WideBand (UWB), ZigBee, Near Field Communication (NFC), Wireless-Fidelity (Wi-Fi), Wi-Fi Direct, Wireless USB (Wireless Universal Serial Bus), and the like. The short-range communication module 113 in general supports wireless communications between the electronic device 100 and a wireless communication system, communications between the electronic device 100 and another electronic device, or communications between the electronic device and a network where another electronic device (or an external server) is located, via wireless area networks. The short-range communication module denotes a module for short-range communications.

Meanwhile, short-range communication between electronic devices may be performed using the 4G wireless communication module 111 and the 5G wireless communication module 112 . In one implementation, short-range communication may be performed between electronic devices in a device-to-device (D2D) manner without passing through base stations.

Meanwhile, for transmission speed improvement and communication system convergence, carrier aggregation (CA) using at least one of the 4G wireless communication module

111 and 5G wireless communication module 112 and the Wi-Fi communication module 113 . In this regard, 4G+WiFi carrier aggregation (CA) may be performed using the 4G wireless communication module 111 and the Wi-Fi communication module 113 . Alternatively, 5G+WiFi carrier aggregation (CA) may be performed using the 5G wireless communication module 112 and the Wi-Fi communication module 113 .

The location information module 114 is a module for acquiring a location (or current location) of an electronic device, and a representative example thereof includes a Global Positioning System (GPS) module or a Wireless Fidelity (WiFi) module. For example, when the electronic device uses a GPS module, a position of the electronic device may be acquired using a signal sent from a GPS satellite. As another example, when the electronic device uses the Wi-Fi module, a position of the electronic device can be acquired based on information related to a wireless access point (AP) which transmits or receives a wireless signal to or from the Wi-Fi module. If desired, the location information module 114 may alternatively or additionally function with any of the other modules of the wireless communication unit 110 to obtain data related to the position of the electronic device. The location information module 114 is a module used for acquiring the position (or the current position) of the electronic device and may not be limited to a module for directly calculating or acquiring the position of the electronic device.

Specifically, when the electronic device utilizes the 5G wireless communication module 112 , the position of the electronic device may be acquired based on information related to the 5G base station which performs radio signal transmission or reception with the 5G wireless communication module. In particular, since the 5G base station of the mmWave band is deployed in a small cell having a narrow coverage, it is advantageous to acquire the position of the electronic device.

The input unit 120 may include a camera 121 for inputting an image signal, a microphone 122 or an audio input module for inputting an audio signal, or a user input unit 123 (for example, a touch key, a push key (or a mechanical key), etc.) for allowing a user to input information. Audio data or image data collected by the input unit 120 may be analyzed and processed by a user's control command.

The sensor unit 140 may typically be implemented using one or more sensors configured to sense internal information of the electronic device, the surrounding environment of the electronic device, user information, and the like. For example, the sensing unit 140 may include a proximity sensor 141 , an illumination sensor 142 , a touch sensor, an acceleration sensor, a magnetic sensor, a G-sensor, a gyroscope sensor, a motion sensor, an RGB sensor, an infrared (IR) sensor, a finger scan sensor, a ultrasonic sensor, an optical sensor (for example, refer to the camera 121 ), a microphone 122 , a battery gage, an environment sensor (for example, a barometer, a hygrometer, a thermometer, a radiation detection sensor, a thermal sensor, a gas sensor, etc.), and a chemical sensor (for example, an electronic nose, a health care sensor, a biometric sensor, etc.). The electronic device disclosed herein may be configured to utilize information obtained from one or more sensors, and combinations thereof.

The output unit 150 may be configured to output an audio signal, a video signal or a tactile signal. The output unit 150 may include a display module 151 , an audio output module 152 , a haptic module 153 , an optical output unit 154 and the like. The display module 151 may have an inter-layered structure or an integrated structure with a touch sensor in order to implement a touch screen. The touch screen may function as the user input unit 123 which provides an input interface between the electronic device 100 and the user and simultaneously provide an output interface between the electronic device 100 and a user.

The interface unit 160 serves as an interface with various types of external devices that are coupled to the electronic device 100 . The interface unit 160 , for example, may include wired or wireless headset ports, external power supply ports, wired or wireless data ports, memory card ports, ports for connecting a device having an identification module, audio input/output (I/O) ports, video I/O ports, earphone ports, or the like. In some cases, the electronic device 100 may perform assorted control functions associated with a connected external device, in response to the external device being connected to the interface unit 160 .

The memory 170 is typically implemented to store data to support various functions or features of the electronic device 100 . For instance, the memory 170 may be configured to store application programs executed in the electronic device 100 , data or instructions for operations of the electronic device 100 , and the like. At least some of those application programs may be downloaded from an external server via wireless communication. Other application programs may be installed within the electronic device 100 at the time of manufacturing or shipping, which is typically the case for basic functions of the electronic device 100 (for example, receiving a call, placing a call, receiving a message, sending a message, and the like). It is common for application programs to be stored in the memory 170 , installed in the electronic device 100 , and executed by the controller 180 to perform an operation (or function) for the electronic device 100 .

The controller 180 typically functions to control an overall operation of the electronic device 100 , in addition to the operations associated with the application programs. The controller 180 may provide or process information or functions appropriate for a user in a manner of processing signals, data, information and the like, which are input or output by the aforementioned components, or activating the application programs stored in the memory 170 .

Also, the controller 180 may control at least some of the components illustrated in FIG. 1 A , to execute an application program that have been stored in the memory 170 . In addition, the controller 180 may control a combination of at least two of those components included in the electronic device 100 to activate the application program.

The power supply unit 190 may be configured to receive external power or provide internal power in order to supply appropriate power required for operating elements and components included in the electronic device 100 , under the control of the controller 180 . The power supply unit 190 may include a battery, and the battery may be configured to be embedded in the terminal body, or configured to be detachable from the terminal body.

At least part of the components may cooperatively operate to implement an operation, a control or a control method of an electronic device according to various implementations disclosed herein. Also, the operation, the control or the control method of the electronic device may be implemented on the electronic device by an activation of at least one application program stored in the memory 170 .

Referring to FIGS. 1 B and 1 C , the disclosed electronic device 100 includes a bar-like terminal body. However, the present disclosure may not be necessarily limited to this, and may be also applicable to various structures such as a watch type, a clip type, a glasses type, a folder type in which two or more bodies are coupled to each other in a relatively movable manner, a slide type, a swing type, a swivel type, and the like. Discussion herein will often relate to a particular type of electronic device. However, such teachings with regard to a particular type of electronic device will generally be applied to other types of electronic devices as well.

Here, considering the electronic device 100 as at least one assembly, the terminal body may be understood as a conception referring to the assembly.

The electronic device 100 will generally include a case (for example, frame, housing, cover, and the like) forming the appearance of the terminal. In this implementation, the electronic device 100 may include a front case 101 and a rear case 102 . Various electronic components may be incorporated into a space formed between the front case 101 and the rear case 102 . At least one middle case may be additionally positioned between the front case 101 and the rear case 102 .

A display module 151 may be disposed on a front surface of the terminal body to output inf

CLAIMS

Claims ( 20 )

The invention claimed is:

1. An electronic device having an antenna, the electronic device comprising:

an array antenna implemented as a multi-layer substrate inside the electronic device, the array antenna comprising a plurality of antenna elements; and

a transceiver circuit that controls a signal applied to each antenna element of the array antenna to perform beamforming through the array antenna,

wherein each of the antenna elements comprises:

a patch antenna disposed on a specific layer of the multi-layer substrate, the patch antenna comprising a first patch and a second patch spaced apart from each other by a predetermined spacing; and

a ground layer disposed under the patch antenna, the ground layer having a slot, and

wherein the first patch and the second patch are connected to the ground layer through a plurality of vias, and the plurality of vias are disposed in a length direction of the slot to be adjacent to the slot.

2. The electronic device of claim 1 , wherein each of the antenna elements operates as a magnetic dipole type slot antenna by a magnetic field formed in a second slot between the first patch and the second patch in a first frequency band, and

operates as an electric dipole type patch antenna by the first patch and the second patch in a second frequency band different from the first frequency band.

3. The electronic device of claim 1 , wherein the plurality of vias comprise:

a plurality of first vias disposed at predetermined intervals on one side surface of the first patch to connect the one side surface of the first patch and the ground layer; and

a plurality of second vias disposed at predetermined intervals on one side surface of the first patch to connect the ground layer and the other side surface of the second patch facing the one side surface of the first patch.

4. The electronic device of claim 1 , further comprising:

a feeding line disposed under the ground layer, and configured to transmit a signal to the patch antenna through the slot,

wherein a first signal of a first frequency band forms a magnetic field through a second slot between the first patch and the second patch through the feeding line and the plurality of vias, and

wherein a second signal of a second frequency band is coupled to the patch antenna through the feeding line and the slot to form an electric field on the patch antenna.

5. The electronic device of claim 1 , wherein a radio frequency integrated chip (RFIC), which is the transceiver circuit, is connected to a feeding line in the form of bumping under the feeding line to transmit a millimeter wave band signal between the RFIC and the feeding line.

6. The electronic device of claim 1 , further comprising:

a parasitic patch disposed on a substrate above the patch antenna to extend an operating bandwidth of the antenna element,

wherein as the center of the parasitic patch is offset compared to the center of the patch antenna, a beam peak of the antenna element is tilted by a first angle from the boresight.

7. The electronic device of claim 6 , further comprising:

a second parasitic patch disposed above the parasitic patch to further extend the operating bandwidth of the antenna element,

wherein as the center of the second parasitic patch is offset compared to the center of the parasitic patch, the beam peak of the antenna element is tilted by a second angle greater than the first angle from the boresight.

8. The electronic device of claim 6 , wherein the multi-layer substrate is disposed inside a body of the electronic device, and

wherein the body comprises:

a metal region defined at a side surface portion of the electronic device, and disposed to disallow a signal radiated from the antenna element to pass therethrough;

an un-transparent region defined at a front or rear surface portion of the electronic device to disallow a signal radiated from the antenna element to pass therethrough; and

a dielectric region defined between a side metal region and the un-transparent region and disposed to allow a signal radiated from the antenna element to pass therethrough.

9. The electronic device of claim 1 , wherein the array antenna is configured as a one-dimensional array antenna such that a predetermined number of antenna elements are disposed in one axial direction to perform beamforming in the one axial direction, and

wherein a beam-formed signal is radiated from the array antenna to the outside through a curved dielectric region defined in the body of the electronic device.

10. The electronic device of claim 1 , wherein the array antenna is configured as a two-dimensional array antenna in which a predetermined number of antenna elements are disposed in one axial direction and a predetermined number of antenna elements are disposed in the other axial direction,

wherein a beam-formed signal is radiated from the array antenna to the outside through a curved second dielectric region defined in the body of the electronic device, and

wherein a width of the second dielectric region is disposed to be narrower than that of the dielectric region due to the directivity of the two-dimensional array antenna in the other axial direction.

11. The electronic device of claim 1 , wherein the patch antenna comprises first to fourth patches spaced apart in one axial direction and the other axial direction,

wherein the ground layer has an orthogonal slot disposed to be orthogonal to the one axial direction and the other axial direction, and

wherein the plurality of vias are disposed along vertical and horizontal side surfaces in each of the first to fourth patches adjacent to the orthogonal slot such that each of the antenna elements forms a dual polarization.

12. The electronic device of claim 11 , further comprising:

a first feeding line disposed in parallel to a vertical slot of the orthogonal slot under the ground; and a second feeding line disposed in parallel to a horizontal slot of the orthogonal slot under the ground,

wherein the each of the antenna elements generates a vertically polarized signal by a first signal from the first feeding line, and

wherein the each of the antenna elements generates a horizontally polarized signal by a second signal from the second feeding line.

13. The electronic device of claim 1 , wherein the array antenna is configured as a two-dimensional array antenna in which a predetermined number of antenna elements are disposed in one axial direction and a predetermined number of antenna elements are disposed in the other axial direction, and

wherein a direction of the slot is defined in the same direction for all antenna elements, and a plurality of electric band gap (EBG) structures are periodically disposed on the ground and a substrate on which the patch antenna is disposed in the multi-layer substrate in a length direction of the slot so as to improve the efficiency of the array antenna.

14. The electronic device of claim 13 , wherein the plurality of EBG structures are disposed in a one-dimensional structure on both side surfaces of the multi-layer substrate in a structure ground-connected to the substrate on which the patch antenna is disposed, and a plurality of EBG vias, which are connection structures disposed on the EBG structures, are arranged in parallel to the plurality of vias arranged in the patch antenna to improve antenna efficiency.

15. The electronic device of claim 1 , further comprising:

a baseband processor connected to the transceiver circuit and configured to control the transceiver circuit so as to perform beamforming and multi-input multi-output (MIMO) through a plurality of array antennas disposed at different positions of the electronic device,

wherein the baseband processor performs beamforming in different directions to radiate signals to dielectric regions defined in different directions through a first array antenna and a second array antenna among the plurality of array antennas so as to improve an isolation between a plurality of MIMO streams.

16. An electronic device having an antenna, the electronic device comprising:

an array antenna implemented as a multi-layer substrate inside the electronic device, the array antenna comprising a plurality of antenna elements;

a case constituting a body of the electronic device and having a dielectric region to allow a signal through the array antenna to be radiated to the outside; and

a processor that controls a signal applied to each antenna element of the array antenna to perform beamforming through the array antenna,

wherein each of the antenna elements comprises:

a patch antenna disposed on a specific layer of the multi-layer substrate, the patch antenna comprising a first patch and a second patch spaced apart from each other by a predetermined spacing; and

a ground layer disposed under the patch antenna, the ground layer having a slot, and

17. The electronic device of claim 16 , wherein the plurality of vias comprise:

a plurality of first vias disposed at predetermined intervals on one side surface of the first patch to connect the one side surface of the first patch and the ground layer; and

18. The electronic device of claim 16 , further comprising:

a feeding line disposed under the ground layer, and configured to transmit a signal to the patch antenna through the slot,

wherein a first signal of a first frequency band forms a magnetic field through a second slot between the first patch and the second patch through the feeding line and the plurality of vias, and

wherein a second signal of a second frequency band is coupled to the patch antenna through the feeding line and the slot to form an electric field on the patch antenna.

19. The electronic device of claim 16 , wherein a radio frequency integrated chip (RFIC), which is the processor, is connected to a feeding line in the form of bumping under the feeding line to transmit a millimeter wave band signal between the RFIC and the feeding line.

20. The electronic device of claim 16 , wherein the processor comprises:

an RFIC connected to the feeding line and configured to transmit a phase-changed signal to each of the antenna elements; and

a baseband processor connected to the RFIC and configured to control the RFIC so as to perform beamforming and multi-input multi-output (MIMO) through a plurality of array antennas disposed at different positions of the electronic device, and

US17/773,008

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2023-08-18

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( en )

2022-12-22

CN112751170B

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2023-05-23

CN112751170A

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Electronic device comprising 5G antenna — Lg Electronics Inc. (US11929564B2)

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