arXiv (OAI Expanded)open access
COOL: A Cooling-Aware Point Transformer Framework for Thermal Prediction in Advanced 3D/3.5D IC Packaging
computational engineering, finance, and science
This document is indexed with metadata only — full text is not available in the archive for this record.
Open the official source ↗
Record · ID 616519
Retrieved via
Conceptio — every document is proof-bundled with source, license, and retrieval metadata.