Arxiv Allmetadata only
COOL: A Cooling-Aware Point Transformer Framework for Thermal Prediction in Advanced 3D/3.5D IC Packaging
computational engineering, finance, and science
This document is indexed with metadata only — full text is not available in the archive for this record.
Open the official source ↗
Record · ID 617019
Conceptio Open Knowledge Archive — every document is proof-bundled with source, license, and retrieval metadata.