Journal of Thermal Engineering
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Geometric Modification and Placement of High Flux IC Chips on Substrates of Different Materials for Enhanced Heat Transfer
This article presents the significance of using different sizes and positions of IC (Integrated Circuit) chips that are mounted on substrates of different materials. The ICs are cooled by forced convection in a horizontal wind tunnel. COMSOL Multiphysics 5.4 solve the IC chip cooling problem by sele
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