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Layer-by-layer nanoassembly combined with microfabrication techniques for microelectronics and microelectromechanical systems
The objective of this work is to investigate the combination of layer-by-layer self-assembly with microfabrication technology and its applications in microelectronics and MEMS. One can assemble, on a standard silicon wafer, needed multilayers containing different nanoparticles and polymers and then
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