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Predictive Structure to Thermal Conductivity Modeling Framework for BEOL Interconnect Stacks in Advanced Technology Nodes Enabled by Extensive Layer Resolved Thermal Measurements

Huang, Zifeng et al.
arXiv (All) · Papers · License: Open Access
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materials-sciencemesoscale-and-nanoscale-physics
mesoscale and nanoscale physics, materials science
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Record · ID 1034141
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