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Highly viable nanoparticle based Thermal Interface Materials (TIM) for electronics device cooling applications

S. Uma MAHESHWARI, A. Brusly SOLOMON, G. THILAGAVATHI, Madhukar HEMAMALINI, D. ILLAKKIAM
Journal of Thermal Engineering · Papers
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nanoparticles
bond line thickness; effective thermal contact resistance; heat transfer applications; nanoparticles; thermal interface material.
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Record · ID 940573
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