Conceptio › Archive › HAL (France)
HAL (France)open access

Numerical study of the thermomechanical response of printed circuit boards with embedded flip-chips

Paul Perin et al.
HAL (France) · Papers · License: Open Access
Open Source ↗
0, Printed circuit board, Unified viscoplastic model, Manufacturing process, Solder bars, Embedded component, 1, Finite element modeling
This document is indexed with metadata only — full text is not available in the archive for this record. Open the official source ↗
Record · ID 326150
Retrieved via Conceptio — every document is proof-bundled with source, license, and retrieval metadata.