Finland – Laboratory, optical and precision equipments (excl. glasses) – Magnetron sputter (MST) system — Tampere University Foundation sr (FIN) · 409600 EUR

2026-08-04+00:00 06:35:40+00:00 409600 RES-0001 selec-w ORG-0002 ORG-0002 TEN-0001 t-sme 5 CON-0001 LOT-0000 TEN-0001 409600 no TPA-0001 LOT-0000 Lesker Company/ TAU/7560/2025 CON-0001 2026-06-23Z 2026-08-03Z Magnetron sputter (MST) system ORG-0002 TAU/7560/2025 TEN-0001 TPA-0001 ORG-0003 29 http://www.oikeus.fi/markkinaoikeus ORG-0001 Markkinaoikeus Radanrakentajantie 5 Helsinki 00520 FI1B1 FIN 3006157-6 +358 295643300 markkinaoikeus@oikeus.fi false false http://www.tuni.fi/en ORG-0002 Tampere University Foundation sr Tampere 33100 FI19B FIN 2844561-8 Arto Heikkilä +358 503015565 hankinnat@tuni.fi https://www.lesker.com/ sme ORG-0003 Kurt J. Lesker Company GmbH Fritz-Schreiter-Str. 18 Dresden 01259 DED21 DEU DE250452616 http://hankintailmoitukset.fi ORG-0004 Hansel Oy (Hilma) Mannerheiminaukio 1a Helsinki 00100 FI1B1 FIN FI09880841 eSender 029 55 636 30 tekninen@hankintailmoitukset.fi 00542073-2026 149/2026 2026-08-05+02:00 2.3 eforms-sdk-1.13 f478850f-ea01-4e13-bf97-46e631335b57 6f912bcd-0551-43b7-9bce-2156efeaa315 2026-08-04+00:00 06:35:39+00:00 01 32014L0024 can-standard ENG body-pl education ORG-0002 ted-esen ORG-0004 open 25da1eb9-76eb-4690-8ba2-37759fabf52c-01 false TAU/7560/2025 Magnetron sputter (MST) system Tampere University Foundation sr is inviting tenders for 'Magnetron sputter (MST) system', hereinafter 'MST' or 'System'. supplies Tampere University ('TAU') is procuring a system that enables to:

i) Metallization of semiconductor wafers and other substrates with high purity metals and pre-cleaning of substrate insitu in high vacuum towards optimal adhesion and low resistivity ohmic contacts, ii) Deposition of ITO (Indium Tin Oxide) on various sample types such as glass and silicon.

* * *

Optoelectronics: The system will be employed in the research of high-performance semiconductor devices to create high quality metal contacts to semiconductors and to provide i.e. solder layers that are used to interface devices to different type of chip carriers

The device wafers are typically wafers from 2” to 4” or fragments of these wafers with thickness variation from 100 µm to 650 µm. R&D of such devices requires system with fast cycle times, reproducibility and high-quality coatings. Removal of native oxide is important property. Critical characteristics are also a user-friendly and intuitive user interface, enabling simple use of the system and effective process development.

* * *

Biomedical technology: The system will be used for thin film coatings for various biomedical applications, especially microelectrode arrays and other sensors. 49 mm x 49 mm glass substrates are the current specialty, but also any other size and shape of glass, semiconductor and polymer substrates are possible up to 6-8” in diameter and few mm in thickness.

* * *

Overall: The system under procurement should have an open platform in hardware and software level to enable TAU to further develop new processes. Moreover, the system should enable us to use it in a manual operation mode as well as automating a part or the complete process flow.

Maximum of three (3) most promising tenderers are selected to provide demonstration. E.g. Step coverage will be tested: - Ultimately critical: Compatibility with lift-off resist processing. - Step coverage to manage 2 µm steps (with vertical sidewalls) with conformal enough coatings to allow min 20 % of film thickness on sidewalls - If system has capability for operator to adjust target-substrate distance these can be evaluated in extremes producing best results.

The system delivery process includes a design review step, in which TAU and the tenderer awarded with the contract, review the final system configuration.

- - - -

PRICING GUIDANCE:

Fixed budget of max 410 000 € (excl. VAT) to be utilized. Tenderers are expected to maximize the offering within the budget. 38000000 FI19B FIN LOT-0000 false no-eu-funds poi-exa 60 quality Technical quality Technical quality poi-exa 15 quality Service and support Service and support poi-exa 25 quality Evaluation of demo Evaluation of demo . ORG-0001 true false none none TAU/7560/2025 Magnetron sputter (MST) system Tampere University Foundation sr is inviting tenders for 'Magnetron sputter (MST) system', hereinafter 'MST' or 'System'. supplies Tampere University ('TAU') is procuring a system that enables to:

i) Metallization of semiconductor wafers and other substrates with high purity metals and pre-cleaning of substrate insitu in high vacuum towards optimal adhesion and low resistivity ohmic contacts, ii) Deposition of ITO (Indium Tin Oxide) on various sample types such as glass and silicon.

* * *

Optoelectronics: The system will be employed in the research of high-performance semiconductor devices to create high quality metal contacts to semiconductors and to provide i.e. solder layers that are used to interface devices to different type of chip carriers

The device wafers are typically wafers from 2” to 4” or fragments of these wafers with thickness variation from 100 µm to 650 µm. R&D of such devices requires system with fast cycle times, reproducibility and high-quality coatings. Removal of native oxide is important property. Critical characteristics are also a user-friendly and intuitive user interface, enabling simple use of the system and effective process development.

* * *

Biomedical technology: The system will be used for thin film coatings for various biomedical applications, especially microelectrode arrays and other sensors. 49 mm x 49 mm glass substrates are the current specialty, but also any other size and shape of glass, semiconductor and polymer substrates are possible up to 6-8” in diameter and few mm in thickness.

* * *

Overall: The system under procurement should have an open platform in hardware and software level to enable TAU to further develop new processes. Moreover, the system should enable us to use it in a manual operation mode as well as automating a part or the complete process flow.

Maximum of three (3) most promising tenderers are selected to provide demonstration. E.g. Step coverage will be tested: - Ultimately critical: Compatibility with lift-off resist processing. - Step coverage to manage 2 µm steps (with vertical sidewalls) with conformal enough coatings to allow min 20 % of film thickness on sidewalls - If system has capability for operator to adjust target-substrate distance these can be evaluated in extremes producing best results.

The system delivery process includes a design review step, in which TAU and the tenderer awarded with the contract, review the final system configuration.

- - - -

PRICING GUIDANCE:

Fixed budget of max 410 000 € (excl. VAT) to be utilized. Tenderers are expected to maximize the offering within the budget. 38000000 FI19B FIN UNLIMITED 2000-01-01Z

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