2026-08-28+00:00 10:29:49+00:00 464674 RES-0001 selec-w TEN-0001 t-med 1 CON-0001 LOT-0000 TEN-0001 464674 no TPA-0001 LOT-0000 tenderReference-4919104-945233 CON-0001 2026-07-01Z EQUIPMENT PURCHASE AGREEMENT 11/206/2026 / Wafer metrology TEN-0001 TPA-0001 ORG-0003 29 http://www.oikeus.fi/markkinaoikeus ORG-0001 Markkinaoikeus Radanrakentajantie 5 Helsinki 00520 FI1B1 FIN 3006157-6 +358 295643300 [email protected] false false https://www.vttresearch.com/fi ORG-0002 VTT Technical Research Centre of Finland Ltd P.O. Box 1000, VTT Espoo 02044 FI1B1 FIN 2647375-4 VTT Technical Research Centre of Finland Ltd +358 20722111 [email protected] medium ORG-0003 FRT GmbH Friedrich-Ebert-Strasse 75, Bergisch Gladbach Friedrich-Ebert-Str 75, Bergisch Gladbach 51429 DEA23 DEU 95573138 http://hankintailmoitukset.fi ORG-0004 Hansel Oy (Hilma) Mannerheiminaukio 1a Helsinki 00100 FI1B1 FIN FI09880841 eSender 029 55 636 30 [email protected] 00598555-2026 167/2026 2026-08-31+02:00 2.3 eforms-sdk-1.13 dee82c87-d381-4b1a-a555-1f46287ddabf fd377a60-ed62-4667-9bf7-823fce97b68d 2026-08-28+00:00 10:29:48+00:00 01 32014L0024 can-standard ENG pub-undert econ-aff ORG-0002 ted-esen ORG-0004 The tender process was based on the open procedure applicable to contracts that exceed the EU procurement threshold. open 2e447f92-6d41-49cf-aa25-e70483323abf-01 false Ref.no. 11/206/2026 Wafer metrology The object of the tender was semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited.
The tool had to be compatible with installation in an ISO 4 classified cleanroom.
The object of the tender process was described in more detail in the invitation to tender documents. supplies The object of the tender process was described in more detail in the invitation to tender documents. 38000000 38300000 Please see the invitation to tender. Tekniikantie 17 Espoo 02150 FI1B1 FIN LOT-0000 false no-eu-funds per-exa 90 price The evaluation of the tenders is described in section 'Grounds for decision'. per-exa 10 quality The evaluation of the tenders is described in section 'Grounds for decision'. ORG-0002 The appeal period is determined in accordance with the Act on Public Procurement and Concession Contracts (1397/2016). ORG-0001 true false none none Ref.no. 11/206/2026 Wafer metrology The object of the tender was semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited.
The tool had to be compatible with installation in an ISO 4 classified cleanroom.
The object of the tender process was described in more detail in the invitation to tender documents. supplies The object of the tender process was described in more detail in the invitation to tender documents. hum-right 38000000 38300000 Please see the invitation to tender. Tekniikantie 17 Espoo 02150 FI1B1 FIN 36 2000-01-01Z