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Wafer-to-Wafer Bonding: Part: I -- The Coupled Physics Problem and the 2D Finite Element Implementation
Wafer-to-wafer (WxW) bonding is a key enabler for three-dimensional integration, including hybrid bonding for fine-pitch Cu--Cu interconnects. During bonding, wafer deformation and the air entrapped between the wafers interact through a strongly coupled, time-dependent fluid--structure interaction (
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